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A thermal insulation device and an electronic product

A technology for heat insulation devices and electronic products, which is applied to electrical equipment shells/cabinets/drawers, circuits, electrical components, etc. It can solve the problems of large size of the whole machine, limited internal space of electronic products, and high temperature of heat-sensitive components, and achieve The effect of improving usability

Active Publication Date: 2022-04-29
ZTE CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] 1. Graphite heat dissipation: Graphite has high thermal conductivity in the XY direction and low thermal conductivity in the Z direction. Graphite heat dissipation is mainly to disperse hot spots. However, due to the limited internal space of electronic products, it causes heat sensitive elements near the heat source while dispersing heat. The temperature of the device (such as battery, camera, GPS chip, etc.) or local surface area is too high;
[0004] 2. Heat sink or heat pipe for heat dissipation: the heat sink is mainly made of metal with high thermal conductivity, and the heat pipe is to bring the heat of the local overheated area to another place. These two solutions are only heat conduction and cannot effectively insulate;
[0005] 3. Air heat insulation: thicken the whole machine in places where the temperature is determined to be too high, and increase the heat insulation of the air layer, but due to the convection of the air layer, the heat insulation effect is poor;
[0006] 4. Heat insulation of heat insulation pad: The heat insulation effect of the heat insulation pad is poor, and the heat-generating device cannot be uniformed, resulting in excessive temperature of the heat-generating device, and the heat-insulation pad cannot be designed in a three-dimensional form, and it is difficult to heat-sensitive devices. full protection
[0007] In current electronic products, heat insulation is rarely used, and heat dissipation is mainly used to solve heat problems, but only heat dissipation has great limitations on products, and it is difficult to protect non-heat-resistant components
If on the basis of heat dissipation, increase the thickness of the whole machine and increase the air heat insulation, it will lead to a large size of the whole machine, and the internal heat insulation is affected by air convection, the thermal reliability cannot be guaranteed, and it is difficult to achieve satisfaction under different power consumption conditions Effect

Method used

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  • A thermal insulation device and an electronic product
  • A thermal insulation device and an electronic product
  • A thermal insulation device and an electronic product

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0050] like figure 1 As shown, this embodiment provides a heat insulating device 100, which is used between the heating element 6 and the heat sensitive device 7, that is, the heating element 6 and the heat sensitive device 7 are respectively arranged on both sides of the heat insulating device 100, wherein the heating element 6 is electrically connected with the printed circuit board PCB8, and PCB8 controls the work of the heating element 6. The thermal insulation device 100 can prevent the heat generated by the heating element 6 from being transferred to the thermally sensitive device 7 , affecting the normal operation of the thermally sensitive device 7 .

[0051] Specifically, the heat insulation device 100 is an airtight hollow structure, which includes a first cover 1 and a second cover 2 oppositely arranged, the first cover 1 and the second cover 2 are airtightly connected, and the A vacuum chamber 3 is formed inside the first cover 1 and the second cover 2 . The vacu...

Embodiment 2

[0076] like figure 2 As shown, this embodiment provides a heat insulation device 100, which differs from the heat insulation device 100 described in Embodiment 1 mainly in that in this embodiment, the heat conduction element 41 is movably arranged in the vacuum chamber 3 Inside.

[0077] When different heating elements 6 work when the same equipment works in different scenes, in order to ensure that the heat conducting element 41 effectively dissipates heat to the working heating element 6, the heat conducting element 41 is actively arranged in the vacuum chamber 3, so that the heat conducting element 41 can move in the vacuum chamber 3, so that when the position of the heating element 6 is different, the position of the heat conducting element 41 can also be changed, so as to realize the heat dissipation of the heating element 6 and the heat insulation of the heat sensitive device 7.

[0078] According to the heating location, the user can adjust the temperature of each int...

Embodiment 3

[0087] like Image 6 As shown, this embodiment provides a thermal insulation device 100 , which differs from the thermal insulation device 100 described in Embodiment 2 mainly in the way the heat conducting element 42 moves in the vacuum chamber 3 .

[0088] In this embodiment, the heat conduction element 42 can move in the vacuum chamber 3 , such as moving in the front-back direction or the left-right direction. like Image 6 As shown, the thermally conductive element 42 can be composed of Image 6 The position on the left in the middle moves to the position on the right in the sliding direction indicated by the arrow.

[0089] Optionally, the heat insulation device 100 further includes a linear drive component, which can drive the heat conduction element 42 to move.

[0090] In one example, the linear drive part can be a linear motor, and the linear motor is located outside the vacuum chamber 3, and the first cover 1 or the second cover 2 is provided with a mounting throu...

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PUM

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Abstract

The application discloses a heat insulation device and an electronic product. The heat insulation device is a closed hollow structure and includes a first cover and a second cover oppositely arranged, and a vacuum chamber is formed inside the heat insulation device; the first cover is made of a heat-conducting material; a heat-conducting element is arranged in the vacuum chamber , the first end of the heat conduction element is in contact with the inner wall of the first cover. This application can be applied to the field of electronic products, through the heat conduction of the first cover plate, the heat dissipation of the heating element is realized; through the heat insulation of the vacuum chamber, the heat sensitive device is protected; through the heat conduction element, the local temperature of the second cover is realized. Adjust to achieve thermal balance of heat-sensitive components or the whole machine.

Description

technical field [0001] The present application relates to the technical field of electronic products, and more specifically, to a heat insulation device and an electronic product including the heat insulation device. Background technique [0002] In the prior art, there are mainly the following heat dissipation methods: [0003] 1. Graphite heat dissipation: Graphite has high thermal conductivity in the XY direction and low thermal conductivity in the Z direction. Graphite heat dissipation is mainly to disperse hot spots. However, due to the limited internal space of electronic products, it causes heat sensitive elements near the heat source while dispersing heat. The temperature of the device (such as battery, camera, GPS chip, etc.) or local surface area is too high; [0004] 2. Heat sink or heat pipe for heat dissipation: the heat sink is mainly made of metal with high thermal conductivity, and the heat pipe is to bring the heat of the local overheated area to another pl...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K5/02H05K7/20
CPCH05K5/0213H05K7/20436H01L23/34H01L23/367H01L23/3731H01L23/3736H05K7/20518H05K5/0209H05K5/069
Inventor 吴典锋
Owner ZTE CORP