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Coverage measurement method and system

A technology of coverage and coverage information, applied in spectrometry/spectrophotometry/monochromator, measurement device, optical radiation measurement, etc., can solve the problem of not fully meeting the requirements of rapid and accurate assessment of advanced technology node coverage.

Active Publication Date: 2022-04-01
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

While overlaymetrology techniques are generally adequate for their intended purposes, the problem of quickly and accurately assessing coverage of advanced technology nodes has not been fully met

Method used

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  • Coverage measurement method and system
  • Coverage measurement method and system
  • Coverage measurement method and system

Examples

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Embodiment Construction

[0071] It is worth noting that the following disclosure may provide multiple embodiments or examples for practicing different features of the present disclosure. The specific component examples and arrangements described below are only used to briefly illustrate the spirit of the embodiments of the present disclosure, and are not intended to limit the scope of the embodiments of the present disclosure. In addition, the following description may reuse the same symbol or word in multiple examples. However, the purpose of repeated use is only to provide simplified and clear description, and is not intended to limit the relationship among multiple embodiments and / or configurations discussed below. In addition, descriptions of one feature described in the following specification as being connected to, coupled to, and / or formed on another feature, etc., may actually include many different embodiments, including those features directly contacting, or Including other additional featu...

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Abstract

A coverage measurement method comprising: illuminating a coverage target with a multicolored beam; collecting intensity information related to a diffraction spectrum generated by the multicolored beam passing through the coverage target, wherein the diffraction spectrum separates the multicolored beam into a plurality of diffracted beams, the diffracted beams Each of them respectively corresponds to a wavelength of the multicolored light beam; and generating coverage information according to the intensity information related to the diffraction spectrum, the coverage information including the coverage error due to the asymmetry.

Description

technical field [0001] Embodiments of the present disclosure relate to overlay measurements related to the manufacture of integrated circuit devices, and in particular to spectral overlay measurements. Background technique [0002] As integrated circuit technology continues to evolve to smaller dimensions, integrated circuits become more challenging. For example, integrated circuit design includes combining a series of patterned layers and un-patterned layers to form one or more integrated circuit features. The misalignment between different integrated circuit layers will cause performance problems due to the short circuit phenomenon caused by multiple misaligned integrated circuit layers, and may even cause damage to the integrated circuit device. Therefore, the coverage of different integrated circuit layers (generally referred to as the positioning of integrated circuit layer and integrated circuit layer) is so important to ensure the correct function of integrated circu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/311
CPCG01R31/311G03F7/70633G03F7/70616G01J3/2803G01J2003/2806G01J3/28G03F9/7065
Inventor 吴锴谢鸿志陈开雄柯志明陈彦良
Owner TAIWAN SEMICON MFG CO LTD