Electronic component and manufacturing method thereof
A technology of electronic components and manufacturing methods, applied in transformer/inductor parts, inductance/transformer/magnet manufacturing, coil manufacturing, etc., can solve the problems of manufacturing cost and labor
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Embodiment 1
[0028] figure 1 (a) is a perspective view of the electronic component of Example 1 of this embodiment, figure 1 (b) is a transparent perspective view of the electronic component of Example 1 of this invention. and, figure 2 (a)-(d) is a schematic diagram for demonstrating the manufacturing method of the electronic component of Example 1 of this invention. figure 2 (a) is a perspective view which shows the process (henceforth an arrangement|positioning process) which arranges several coils on the upper surface of a magnetic sheet. figure 2 (b) is a perspective view which shows the process (henceforth a sealing process) of sealing several coils in a magnetic sheet laminated body. figure 2 (c) is a perspective view which shows the process (henceforth a cutting process) which cuts the magnetic sheet laminated body in which the coil was sealed, and obtains a magnetic molded body. figure 2 (d) is a perspective view showing the step of forming an external terminal on the mou...
Embodiment 2
[0044] refer to image 3 as well as Figure 4 The electronic component of Example 2 is demonstrated. In addition, the same code|symbol is attached|subjected to the component common to the embodiment already demonstrated. In the electronic component of Example 2, two coils were built in a magnetic molded body by laminating the wound portions thereof along the winding axis direction of the coils.
[0045] image 3 (a) is a perspective view of the electronic component 20 of Example 2 of this embodiment, image 3 (b) is a transparent perspective view of the electronic component 20 of Example 2 of this embodiment. and, Figure 4 (a)-(d) is a schematic diagram for demonstrating the manufacturing method of the electronic component of Example 2 of this invention. Figure 4 (a) shows the process of repeating the disposition process carried out in Example 1, and disposing a plurality of magnetic sheets having a plurality of coils disposed on the upper surface in an overlapping man...
Embodiment 3
[0059] refer to Figure 5 with Image 6 The electronic component of Example 3 is demonstrated. In addition, the same code|symbol is attached|subjected to the component common to the embodiment already demonstrated. In the electronic component of Example 3, two coils were built in a magnetic molded body by stacking their winding portions along the winding axis direction of the coils, and an intermediate layer was arranged between the two coils.
[0060] Figure 5 (a) is a perspective view of the electronic component of Example 3 of this embodiment, Figure 5 (b) is a transparent perspective view of the electronic component of Example 3 of this embodiment. and, Image 6 (a)-(d) is a schematic diagram for demonstrating the manufacturing method of the electronic component of Example 3 of this invention. Image 6 (a) is a perspective view which shows the multilayer arrangement|positioning process of arranging a plurality of magnetic sheets and intermediate|middle sheets super...
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