A processing technology of ultra-thin ceramic fingerprint recognition sheet
A processing technology and fingerprint recognition technology, applied in the field of ultra-thin ceramic product processing, which can solve the problems of large demand for manpower and material resources and complex processing.
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[0029] (1) Choose a ceramic fine rod with a diameter of 51.7 mm, and use a diamond wire saw to cut the incoming material to obtain a ceramic sheet with a thickness of 0.26 mm and a diameter of 51.7 mm. In this step, the specific wire cutting process parameters are:
[0030]
[0031] (2) Use a double-sided coarse grinder to rough grind the cut ceramic sheet with a boron carbide abrasive with a particle size of 30 μm to obtain a ceramic sheet with a thickness of 0.21±0.01 mm. In this step, the coarse grinding process includes 5 stages, and the specific coarse grinding process parameters are:
[0032]
[0033] (3) Chamfer the edges of the upper and lower surfaces of the roughly ground ceramic sheet with a grinding wheel rod or a grinding wheel of CNC or profiling equipment, and the size of the chamfering edge is 0.35mm.
[0034] (4) Use a polishing machine to perform rough polishing on one side of the ceramic sheet that has been chamfered. After rough polishing, the thicknes...
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