Packaging structure and display device

A packaging structure and packaging layer technology, which is applied in the manufacture of electrical components, electrical solid devices, semiconductor/solid devices, etc., can solve the problems of excessively large non-display area and unfavorable narrow borders, etc., to reduce the number of uses, reduce the area, narrow The effect of borders

Active Publication Date: 2018-07-06
BOE TECH GRP CO LTD
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  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

[0004] The present invention provides a packaging structure and a display device to solve the problem that the non-display area in the prior art is too large, which is not conducive to realizing a narrow frame

Method used

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  • Packaging structure and display device
  • Packaging structure and display device
  • Packaging structure and display device

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Embodiment Construction

[0030] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention. Apparently, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention. The shapes and sizes of the components in the drawings do not reflect the actual scale of the display device, but are only intended to schematically illustrate the content of the present invention.

[0031] In describing various exemplary embodiments of the present invention, although the terms "upper," "lower," etc. are used herein to describe various exemplary features and elements of the present invention, these terms are used herein for convenience onl...

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Abstract

The invention provides a packaging structure and a display device. The packaging structure comprises a display substrate and a packaging lamination layer for packaging the display substrate, wherein the packaging lamination layer at least comprises a first inorganic packaging layer, a second inorganic packaging layer and an organic packaging layer clamped between the first inorganic packaging layer and the second inorganic packaging layer, the display substrate comprises a substrate and a multi-layer insulation layer arranged above the substrate, the display substrate is divided into a displayregion and a non-display region surrounding the display region, the multi-layer insulation layer in the non-display region is provided with a cofferdam, the multi-layer insulation layer is provided with at least one first groove at one side of the cofferdam close to the display region, and the organic packaging layer is at least partially arranged in the first groove. The packaging structure is advantaged in that the groove arranged on the display substrate is used for accommodating an organic material for preparation of the organic packaging layer, the quantity of cofferdams and the area ofthe non-display region are reduced, and the narrow framework is realized.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a packaging structure and a display device. Background technique [0002] With the continuous development of display technology, organic light-emitting diode (English: Organic Light-Emitting Diode, hereinafter referred to as OLED) display substrate, quantum dot light-emitting diode (English: Quantum Dot Light Emitting Diodes, hereinafter referred to as QLED) display substrate and other new display substrates are known for their Impact resistance, strong earthquake resistance, light weight, small size, and more convenient to carry have attracted widespread attention. [0003] However, the existing QLED or OLED encapsulation structure is usually a multi-layer thin film encapsulation structure including an organic encapsulation layer and an inorganic encapsulation layer. In the process of preparing the organic encapsulation layer, because the organic encapsulation layer is made of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/52
CPCH10K50/8445
Inventor 张玉欣
Owner BOE TECH GRP CO LTD
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