Mems microphone packaging structure and manufacturing method thereof
A technology of packaging structure and manufacturing method, which is applied to sensors, electrostatic transducers, microphones, electrical components, etc., can solve the problems of large sound damping, low sound sensitivity, damage to the interface of the sound guide cavity, etc., so as to reduce the damping and improve the The effect of sensitivity
Active Publication Date: 2020-09-15
礼鼎半导体科技秦皇岛有限公司
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Problems solved by technology
The adhesive layer at the bond between the substrate and the package carrier is easy to separate from the package carrier due to thermal stress or external force, thereby destroying the interface of the sound guide cavity
[0004] In addition, the MEMS chip in the MEMS microphone in the prior art includes a back cavity facing the packaging carrier on one side, and the volume of the back cavity is small, resulting in a large sound damping, which in turn makes the sound sensitivity not high.
Method used
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[0022] In order to further illustrate the technical means and effects that the present invention takes to reach the intended purpose of the invention, the following in conjunction with the appended Figure 1-9 And the preferred implementation mode, the specific implementation, structure, features and effects of the MEMS microphone package structure and manufacturing method provided by the present invention are described in detail as follows.
[0023] see figure 1 , the present invention provides a MEMS microphone package structure 100 , the MEMS microphone package structure 100 includes a carrier board 110 , at least one ASIC chip 120 , at least one MEMS chip 130 and a microphone case 140 . The ASIC chip 120 and the MEMS chip 130 are formed on the package carrier 110 and electrically connected to the package carrier 110 . The microphone housing 140 is formed on the packaging substrate 110 and combined with the packaging substrate 110 to form a receiving cavity 150 . The ASIC...
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A MEMS microphone packaging structure, comprising a microphone housing, a carrier board and at least one MEMS chip, the MEMS chip and the microphone housing are arranged on the packaging carrier board, the packaging carrier board and the microphone housing are combined to form a receiving cavity , the MEMS chip is accommodated in the housing cavity and is electrically connected to the package carrier, the MEMS chip includes a diaphragm; the package carrier includes at least one laser groove, the laser groove is opposite to the diaphragm and is completely enclosed by the MEMS chip. The invention also relates to a manufacturing method of the package structure of the MEMS microphone.
Description
technical field [0001] The invention relates to the technical field of MEMS microphone packaging, in particular to a MEMS microphone packaging structure and a manufacturing method thereof. Background technique [0002] The MEMS microphone is a microphone (microphone) manufactured using a micro electro mechanical system (MEMS) process. The microphone includes two chips: a MEMS chip and an application specific integrated circuit (ASIC) chip. [0003] The MEMS microphone also includes a loading board, and a through hole (sound guide hole) is formed on the packaging carrier board through mechanical drilling. When packaging, a substrate needs to be placed at the bottom of the through hole to form a closed sound guide cavity. To further play the role of conducting sound, the substrate is generally bonded to the packaging carrier board with adhesive. The glue layer at the bonding place between the substrate and the package carrier is easy to separate from the package carrier due ...
Claims
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IPC IPC(8): H04R19/04H04R31/00
CPCH04R19/04H04R31/00H04R2201/003
Inventor 黄昱程
Owner 礼鼎半导体科技秦皇岛有限公司