Glue flow detection device and method thereof

Abstract

The invention discloses a glue flow detection device, which comprises an inclined platform, a support frame, a glue dispensing head, a charging device, a control valve and a timer, wherein the inclined platform is used for placing a liquid crystal module, and the inclined platform is internally in a hollow structure; the support frame is arranged at the upper end of the inclined platform; the support frame is provided with a sliding rail and a fixation frame, the fixation frame being movably arranged on the sliding rail, and the fixation frame being connected to a cylinder; the glue dispensinghead is movably arranged on the fixation frame of the sliding rail; the glue dispensing head has a glue storage bucket and a glue outlet; the charging device is arranged in the inclined platform, andan air outlet of the charging device is connected to the glue storage bucket of the glue dispensing head; the control valve has two starting switches, which are arranged at the lower end of the inclined platform; the control valve controls start of the cylinder on the sliding rail and the charging device; and the timer is arranged at one side of the inclined platform, and the timer is connected with the control valve. According to the glue flow detection device, by controlling opening and closing of the solenoid valve through the timer, glue output amount under the conditions of different pressures and glue output time is detected quickly.

Description

【Technical field】 [0001] The invention relates to a glue control device and a method thereof, in particular to a glue flow detection device and a method thereof. 【Background technique】 [0002] In the 3C electronic liquid crystal module liquid crystal module bonding process, it is essential to use glue. However, the operators at the factory end have the following disadvantages when carrying out the LCD module bonding process: 1. The manual control system has uneven glue flow, low efficiency, and uneven glue application due to factors such as differences in the technical level of the operators. , cannot guarantee the qualified rate of LCD module bonding. 2. The amount of glue used cannot be controlled, and a large amount of glue has been wasted, which increases the production cost. [0003] In view of this, it is necessary to develop a glue flow detection device and method thereof, which can be used to precisely control the amount of glue used and to control the flow of glu...

AI Technical Summary

Problems solved by technology

However, the operators at the factory end have the following disadvantages when carrying out the LCD module bonding process: 1. The manual control system has uneven glue flow, low efficiency, and uneven glue application due to factors such as differences in the technical level of the operators. , cannot guarantee the passing rate of LCD module bonding

2. The amount of glue used cannot be controlled, and a lot of glue has been wasted, which increases the production cost

[0003] In view of this, it is necessary to develop a glue flow detection device and its method, which are used to precisely control the amount of glue used and to control the flow of glue at a uniform speed, so as to avoid the problems of wasting glue and uneven glue application

Images