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Separation device for cut silicon wafer

A separation device and silicon wafer technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of high fragmentation rate, high labor cost, low output, etc., so as to improve the yield rate and avoid the situation of chasing wafers. , The effect of controllable delivery interval

Pending Publication Date: 2018-07-17
苏州卓樱自动化设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] After the silicon ingot is cut into silicon wafers, the silicon wafers after cutting must be kept in a wet state, and the silicon wafers must be separated and cleaned quickly. Low, high labor costs and other issues

Method used

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  • Separation device for cut silicon wafer
  • Separation device for cut silicon wafer
  • Separation device for cut silicon wafer

Examples

Experimental program
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Embodiment Construction

[0018] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0019] Such as Figure 1-3 As shown, a separation device for cut silicon wafers includes a charging mechanism and a discharging mechanism. The charging mechanism includes a movable seat that moves up and down and a lifting power device that drives the movable seat. The movable seat is provided with a side opening Silicon chip charging frame 1, the bottom of the silicon chip charging frame 1 is provided with a material seat 2 for placing silicon chips that is inclined downward from the opening; Roughly the same water-absorbing seat 3, the lower part of the water-absorbing seat 3 corresponds to the opening of the silicon wafer charging frame 1 and is provided with a front nozzle 4 that sprays water to the silicon wafers on the material-setting seat 2, and the lower part of the water-absorbing seat 3 corresponds to the silicon wafer. The side sp...

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PUM

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Abstract

The invention discloses a separation device for a cut silicon wafer. The separation device comprises a loading mechanism and a discharge mechanism, wherein the loading mechanism comprises a movable seat moving up and down and a lifting power device for driving the movable seat; the movable seat is provided with a silicon wafer loading frame with an opening in the side; a material placement seat which tilts down inwards from the opening for placing the silicon wafer is arranged at the bottom of the silicon wafer loading frame; the discharge mechanism comprises a water absorbing seat which is located at the upper part of the material placement seat and of which the tilt angle is roughly the same as that of the material placement seat; a front spray head for spraying water on the silicon wafer located on the material placement seat is arranged at the position, corresponding to the opening of the silicon wafer loading frame, at the lower part of the water absorbing seat; lateral spray heads for spraying the water on the silicon wafer located on the material placement seat are arranged at the positions, corresponding to two sides of the silicon wafer, at the lower part of the water absorbing seat; the water absorbing seat is provided with at least one discharge belt mechanism for sending the absorbed silicon wafer out of the loading frame; the water absorbing seat is provided with apower mechanism for driving the discharge belt mechanism to rotate; and a plurality of water suction holes are formed in the water absorbing seat and are connected with a water suction pump through awater suction pipe.

Description

technical field [0001] The invention relates to a device for separating cut silicon wafers. Background technique [0002] After the silicon ingot is cut into silicon wafers, the silicon wafers after cutting must be kept in a wet state, and the silicon wafers must be separated and cleaned quickly. Low, high labor costs and other issues. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide an efficient separation device for cut silicon wafers. [0004] In order to solve the above-mentioned technical problems, the technical solution adopted in the present invention is: a kind of separation device for silicon wafers after cutting, including a charging mechanism and a discharging mechanism, and the charging mechanism includes a movable seat that moves up and down and drives the lifting of the movable seat. Power device, the movable seat is provided with a silicon chip charging frame with side openings, and the bottom of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/67271
Inventor 唐亚忠
Owner 苏州卓樱自动化设备有限公司