Vapor discharge apparatus and film formation method

A release device and steam technology, applied in the direction of vacuum evaporation plating, ion implantation plating, gaseous chemical plating, etc., can solve the problems of stable and difficult film formation rate, achieve stable film formation rate, prevent polymerization reaction, prevent condensation effect

Active Publication Date: 2018-07-17
ULVAC INC
View PDF6 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, there are various problems in forming a polymeric organic compound film on a substrate film by such a method in a vacuum.
[0005] That is, it is difficult to form a film of an organic compound monomer on a base material film with a uniform film thickness in a vacuum. In particular, it is very difficult to generate a vapor of an organic compound monomer at a constant rate and to stabilize the film formation rate.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Vapor discharge apparatus and film formation method
  • Vapor discharge apparatus and film formation method
  • Vapor discharge apparatus and film formation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0035] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.

[0036] figure 1 It is an overall configuration diagram of an embodiment of a film forming apparatus using the steam releasing apparatus according to the present invention, figure 2 It is an internal configuration diagram of an embodiment of the steam release device according to the present invention.

[0037] like figure 1 As shown, the film forming apparatus 1 of this embodiment is used to form an organic compound film on a substrate film 10 in a vacuum chamber 2 connected to a vacuum exhaust device 17, and has a vapor releasing device 20 (refer to figure 2 ).

[0038] Here, near the central part of the inside of the vacuum chamber 2, there is provided a cylindrical center roll 3 for contacting and conveying the base material film 10, and around the center roll 3, a steam releasing device 20 described later is provided. The steam discharge par...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The purpose of the present invention is to provide a technique such that when forming an organic compound film on a substrate film in vacuum, vapor of an organic compound monomer can be generated at aconstant rate, thereby stabilizing the film formation rate. This vapor discharge apparatus discharges vapor of an organic compound monomer in vacuum and comprises: a vaporization unit 21 for vaporizing a liquid organic compound monomer; and a vapor discharge unit 22 that is in communication with the vaporization unit 21 and discharges the vapor of the organic compound monomer vaporized by the vaporization unit 21. The vaporization unit 21 is provided therein with a hollow vaporizer 40. The vaporizer 40 is configured such that a mist of the liquid organic compound monomer is introduced therein, the organic compound monomer mist 34 is heated and vaporized, and the organic compound monomer vapor is discharged to the vaporization unit 21.

Description

technical field [0001] The present invention relates to the technology of a film forming apparatus for forming an organic compound film on a substrate film in vacuum. Background technique [0002] In recent years, there has been a demand to efficiently form electronic components on a base material film, and therefore, a technique of transporting a long base material film in a vacuum to form a film composed of a high-molecular organic compound on the base material film has been proposed. . [0003] Conventionally, in the case of forming a high-molecular organic compound film on a base material film in a vacuum, for example, the steps of evaporating an organic compound monomer and spraying the vapor onto the base material film to form an organic compound layer are The organic compound layer is cured by heating or irradiating energy rays to form a polymeric organic compound film. [0004] However, there are various problems in forming a polymeric organic compound film on a ba...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/24C23C16/448
CPCC23C14/24C23C16/448C23C16/52
Inventor 斋藤和彦林信博广野贵启岩桥照明
Owner ULVAC INC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap