Method for adjusting substrate deflection amount by film-forming machine and film-forming process

Abstract

The invention provides a film forming machine table and a method for regulating the base plate deflection quantity by a film forming procedure. The film forming machine table is provided with a rotating mechanism (M) under a carrying table (3); the rotating mechanism (M) is used for driving the carrying table (3) to rotate; when a base plate (9) deflects relative to the carrying table (3) and a mask plate (5), the position of the base plate (9) relative to the carrying table (3) and the mask plate (5) can be conveniently and fast regulated through controlling the rotating mechanism (M) to drive the carrying table (3) and the mask plate (5) to do rotating regulation, so that the base plate (9) does not have deflection relative to the carrying table (3) and the mask plate (5); in the regulation process, the temperature rise and lowering, and the vacuum cavity (1) opening are not needed; the time, the labor and the materials can be saved; the production efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of display manufacturing, in particular to a film forming machine and a method for adjusting the deflection of a substrate in a film forming process. Background technique [0002] In the manufacturing process of Liquid Crystal Display (LCD) and Organic Light Emitting Diode (OLED) display panels, multiple film-forming processes are required, that is, a thin film of a specific material is deposited on a substrate. [0003] In the actual production process of LCD display panels and OLED display panels, a plasma enhanced chemical vapor deposition (Plasma Enhanced Chemical Vapor Deposition, PECVD) process is often used to implement a film forming process. The PECVD process is to introduce the reaction gas into the reactor, and dissociate under the action of heat energy, electric energy or light energy to become highly active ions or ion clusters. The ions or ion clusters reach the surface of the substrate by diff...

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Problems solved by technology

[0007] However, the actual situation is that the position of the substrate 900 may be deflected when the film is placed, such as Figure 4 As shown, after the deflection of the substrate 900, there is a gap with the inner edge of the mask plate 500, causing the carrier 300, that is, the lower electrode plate and the upper electrode plate 700, to have no insulation layer isolation in the gap, which will increase the occurrence of arc damage. This will not only cause physical damage to the substrate 900, but also cause irreversible damage to the carrier 300, that is, the lower electrode plate and the upper electrode plate 700. Therefore, it is necessary to ensure that the substrate 900 is placed when the film forming machine is restored. Production can only proceed after there is no deflection. If the deflection of the substrate 900 occurs during production, the film forming machine must be cooled down and the vacuum chamber 100 must be released to adjust the positions of the stage 300 and the mask plate 500, and then restore the The vacuum state of the vacuum chamber 100 and the temperature rise, the heating and cooling and opening of the cavity in this process will consume a lot of time, manpower and material resources

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