OLED packaging method and packaging structure

A packaging structure and packaging method technology, which is applied in the manufacture of electrical components, electrical solid devices, semiconductor/solid devices, etc., can solve the problems of large thermal deformation differences, film layer peeling, and bubbling, so as to reduce film layer peeling or Bubble probability, elimination of thermal expansion and deformation differences, and effects of improving package reliability

Active Publication Date: 2018-07-27
WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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  • Abstract
  • Description
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  • Application Information

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Problems solved by technology

With such a large difference in thermal performance, it is easy to have a large difference in thermal expansion coefficient at the interface between the organic layer and the inorganic layer in th

Method used

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  • OLED packaging method and packaging structure
  • OLED packaging method and packaging structure
  • OLED packaging method and packaging structure

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Embodiment Construction

[0033] The following descriptions of various embodiments refer to the accompanying drawings to illustrate specific embodiments in which the present invention can be implemented.

[0034] Please refer to image 3 As shown, Embodiment 1 of the present invention provides an OLED packaging structure, including:

[0035] Making a substrate 1 with an OLED device 2;

[0036] A first inorganic barrier layer 31 formed on the substrate 1 and covering the OLED device 2;

[0037] an organic buffer layer 4 formed on the first inorganic barrier layer 31, the organic buffer layer 4 doped with particles having a negative thermal expansion coefficient; and

[0038] The second inorganic barrier layer 32 is formed on the substrate 1 and covers the first inorganic barrier layer 31 and the organic buffer layer 4 .

[0039] It can be seen from the foregoing that the thermal expansion coefficients of the organic buffer layer (organic buffer layer) and the inorganic barrier layer (inorganic barrie...

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Abstract

The invention provides an OLED packaging method and packaging structure. The OLED packaging structure comprises a substrate, a first inorganic barrier layer, an organic buffer layer formed on the first inorganic barrier layer, and a second inorganic barrier layer, wherein an OLED device is manufactured on the substrate; the first inorganic barrier layer is formed on the substrate and covers the OLED device; the organic buffer layer is doped with particles with a negative thermal expansion coefficient; and the second inorganic barrier layer is formed on the substrate and covers the first inorganic barrier layer and the organic buffer layer. The gradient-doped organic buffer layer is formed through doping the particles with the negative expansion coefficient into an organic material, thermaldeformation of the organic buffer layer of the packaging structure can be reduced, and the thermal expansion deformation differences on the interfaces of the organic buffer layer and the inorganic barrier layers are reduced or even eliminated, thereby reducing the film peeling or bubbling probability and improving the packaging reliability.

Description

technical field [0001] The invention relates to the technical field of screen display, in particular to an OLED packaging method and packaging structure. Background technique [0002] With the advancement of technology, people's demand for panel display is also increasing. Flexible OLEDs are widely favored due to their advantages such as wide color gamut, high contrast, wide viewing angle, and flexibility. [0003] It is difficult for human beings to live without mobile phones. Therefore, mobile phones are used in more and more regions, temperatures, and environments. This requires that different environmental tests must be met in the shipment specifications of mobile phones. At present, most of the environmental tests required for mobile phone panels are high temperature and high humidity / low temperature environments, high and low temperature cycle tests, etc. [0004] Flexible OLED packaging mostly adopts an inorganic / organic / inorganic laminated structure, such as figur...

Claims

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Application Information

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IPC IPC(8): H01L51/56H01L51/52
CPCH10K50/844H10K71/00
Inventor 张明杨杰
Owner WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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