Dual side cooling power module and manufacturing method of the same

A technology of cooling power and manufacturing method, applied in the fields of semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve the problems of high module failure rate, premature deterioration of solder, increase thermal resistance, etc., to reduce thermal deformation, The effect of reducing load and efficient heat dissipation

Pending Publication Date: 2020-06-12
HYUNDAI MOBIS CO LTD
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

However, in the case of the soldering method, since the melting point of the solder is in the range from 180°C to 220°C, premature deterioration occurs when the solder is used at a high temperature
[0006] In addition, since the double-sided cooling power module is manufactured by welding, warpage occurs due to the difference in coefficient of thermal expansion (CTE) between materi

Method used

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  • Dual side cooling power module and manufacturing method of the same
  • Dual side cooling power module and manufacturing method of the same
  • Dual side cooling power module and manufacturing method of the same

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[0027] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, it should be understood that the present invention is not limited to the embodiments described below, and may be implemented in various different forms, and the following embodiments are provided to complete the disclosure of the present invention and to fully convey the scope of the present invention to those skilled in the art personnel. In addition, the sizes of components in the drawings may be exaggerated or reduced for convenience of description.

[0028] In the following, the following will refer to Figure 1 to Figure 13 Problems caused by the construction and handling of double-sided cooling power modules and their solutions are described.

[0029] first, Figure 14 is a cross-sectional view schematically showing a double-sided cooling power module according to a comparative example of the present invention. The double-side cool...

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Abstract

The invention provides a dual side cooling power module and a manufacturing method of the same. The dual side cooling power module includes: a lower substrate including a recessed portion on at leastone surface thereof, a semiconductor chip formed in the recessed portion, lead frames formed at both ends of the lower substrate, and an upper substrate formed on the semiconductor chip, a portion ofthe lead frames, and the lower substrate.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS [0002] This application claims priority from Korean Patent Application No. 10-2018-0155073 filed on December 5, 2018, the contents of which are incorporated herein by reference. technical field [0003] The present invention relates to a double-side cooling power module and a method of manufacturing the same, and more particularly, to a double-side cooling power module and a method of manufacturing the same, the double-side cooling power module being applied to an environmentally friendly vehicle (hybrid electric vehicle) Vehicle (HEV), Electric Vehicle (EV), Plug-in Hybrid Electric Vehicle (PHEV), etc.), and this double-side cooling power module applies SiC elements. Background technique [0004] A double-sided cooling power module applied to inverters for environmentally friendly vehicles (HEV, EV, PHEV, etc.) can meet electrical specifications when it adopts a configuration in which a plurality of SiC elements form a multi-...

Claims

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Application Information

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IPC IPC(8): H01L23/13H01L23/367H01L23/373H01L21/48H01L21/52
CPCH01L23/13H01L21/4803H01L21/52H01L23/367H01L23/3736H01L23/3735H01L23/49844H01L23/49833H01L23/4334H01L23/49531H01L23/3121H01L2224/33181H01L2224/73265H01L2924/181H01L2224/29147H01L2224/2929H01L2224/293H01L2224/29339H01L2224/29139H01L2224/29082H01L2924/15153H01L24/29H01L24/32H01L24/30H01L2224/3003H01L2224/16227H01L2224/32227H01L24/16H01L24/13H01L2224/13147H01L2224/13139H01L2224/1329H01L2224/13294H01L2224/29294H01L2224/133H01L2224/13339H01L24/14H01L2224/13082H01L2224/1403H01L2224/3303H01L2224/73253H01L24/83H01L24/81H01L24/33H01L24/73H01L24/92H01L2224/92225H01L2224/8384H01L2224/83855H01L2224/92H01L2924/00014H01L2224/81H01L21/56H01L2224/83H01L23/31H01L21/563H01L23/495H01L23/49568H01L23/49861H01L2021/60195H01L2021/60277
Inventor 赵汉信
Owner HYUNDAI MOBIS CO LTD
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