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Two-dimensional thermal deformation and thermal stress analysis method for anisotropic materials based on meshless rkpm

An anisotropic and orthotropic technology, applied in the field of numerical heat transfer, can solve the problem of thermal deformation and thermal stress without further research on complex structures of two-dimensional anisotropic materials, without consideration of thermal deformation and thermal stress , No research on thermal deformation and thermal stress issues, etc., to achieve good theoretical research and engineering application value, avoid grid distortion, and achieve good numerical stability

Active Publication Date: 2021-07-09
XIANGTAN UNIV
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  • Application Information

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Problems solved by technology

Yuan Suling et al. used EFGM to solve the heat conduction and thermal stress problems of steam turbine rotors; Hong Xinlan et al. used EFGM to study the thermal deformation and thermal stress problems of square plate structures; Wang Feng et al. used the improved EFG-SBM method (meshless Galio A new method combining the gold method and the boundary finite element method) has studied the thermal stress problem of the continuum, but most of the above studies are limited to the thermal stress problem of isotropic materials or structures with simple geometries
Although Zhang Jianping and Zhou Guoqiang used EFGM and meshless RKPM to study the temperature field distribution of two-dimensional anisotropic material structure and the topology optimization design of thermal structure of two-dimensional anisotropic material, they did not consider the deeper thermal deformation and The problem of thermal stress, that is, the problem of thermal deformation and thermal stress under the joint constraints of thermal boundary and displacement boundary, thermal load and mechanical load is not studied, but the material thermal conductivity orthotropic factor and anisotropy are simply considered The effect of material orientation angle on the heat transfer performance of two-dimensional anisotropic material structures, that is, the influence on the temperature field distribution law, without further development of thermal deformation and thermal deformation of complex structures of two-dimensional anisotropic materials based on meshless RKPM stress study
In addition, there is no general-purpose commercial software for the mesh-free method at present, so scholars first deduce the algorithm formula, and then program the theory and application of the mesh-free method by themselves.

Method used

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  • Two-dimensional thermal deformation and thermal stress analysis method for anisotropic materials based on meshless rkpm
  • Two-dimensional thermal deformation and thermal stress analysis method for anisotropic materials based on meshless rkpm
  • Two-dimensional thermal deformation and thermal stress analysis method for anisotropic materials based on meshless rkpm

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Embodiment Construction

[0061] see figure 1 and figure 2 , the analysis method of two-dimensional thermal deformation and thermal stress of anisotropic material structure based on meshless RKPM mainly includes the following steps:

[0062] First, the conversion relationship between the thermal conductivity, stress component and strain component between the geometric coordinate system X—Y and the material coordinate system 1—2 is established, and the heat flux along the geometric coordinate axis direction is:

[0063]

[0064]

[0065] In the above formula, λ ij (i,j=1,2) is the thermal conductivity coefficient that varies with geometric coordinates, is the transformation matrix, λ 1 and lambda 2 is the thermal conductivity in the 1 and 2 directions of the principal axes of the material coordinate system. Define the material's thermal conductivity orthotropic factor Ht = λ 1 / λ 2 .

[0066] The relationship between the thermal stress component and the strain component is established as...

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Abstract

The invention discloses a two-dimensional thermal deformation and thermal stress analysis method of anisotropic material structure based on gridless RKPM, which mainly includes the following steps: (1) performing RKPM node discrete pre-processing on the calculation model; (2) solving the RKPM thermal deformation Displacement value: Assemble the RKPM overall force stiffness matrix and the overall thermal load column vector; impose boundaries, and use the penalty function method to deal with the first type of boundary conditions; establish an anisotropic material structure meshless RKPM thermal stress discrete control equation, and solve the nodes RKPM thermal deformation displacement parameter value; (3) solve the RKPM thermal stress value, use the reconstruction kernel approximation to approximate the obtained thermal deformation displacement parameter value, and calculate the thermal stress of the Gauss point, and then obtain the RKPM thermal stress value of the node; ( 4) Post-processing the calculation results. The invention conducts the two-dimensional thermal deformation and thermal stress analysis of the anisotropic material structure based on the gridless RKPM, and the numerical method is stable and has high precision.

Description

technical field [0001] The invention belongs to the field of numerical heat transfer in computer-aided engineering, and in particular relates to a two-dimensional thermal deformation and thermal stress analysis method for anisotropic material structures based on a meshless reconstruction kernel particle method (Reproducing Kernel Particle Method, RKPM). . Background technique [0002] Thermal stress widely exists in practical problems in mechanical engineering and power engineering, and it can cause equipment damage, even serious production accidents and huge economic losses. When the temperature of the object changes, due to the external constraints and the mutual constraints between the internal parts, the stress generated by it not being able to expand and contract completely freely is called thermal stress, also known as variable temperature stress. The top area of ​​the engine piston, the steam turbine rotor, the skirt support area of ​​the chemical tower equipment and...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F30/23G06F119/08
CPCG06F30/23G06F2119/08
Inventor 张建平王树森龚曙光吴淑英胡慧瑶刘庭显
Owner XIANGTAN UNIV
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