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oled packaging method
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An encapsulation method and encapsulation adhesive technology, which are applied to semiconductor devices, electrical components, circuits, etc., can solve the serious microcavity effect of OLED display devices, cannot effectively control the height of encapsulation adhesive 6, affect the flatness of color filters 3, etc. problems, to achieve the effect of reducing light output crosstalk, avoiding cracking, and improving consistency
Active Publication Date: 2020-02-14
KUNSHAN FANTAVIEW ELECTRONICS TECH CO LTD
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Problems solved by technology
During the encapsulation process, since the distance between the color filter 3 and the white OLED layer 2 cannot be monitored online, and the height of the encapsulant 6 cannot be effectively controlled, the microcavity effect in the OLED display device is relatively serious, affecting its light effect
At the same time, the height of the encapsulation glue 6 cannot be effectively controlled, which may easily cause the thin film encapsulation layer 4 to break and affect the flatness of the color filter 3 after sealing.
Method used
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Embodiment 1
[0038] see Figure 2 to Figure 3 Shown, a kind of OLED encapsulation method comprises the steps:
[0039] S11, provide the OLED10 to be packaged and the packaging device 20 for packaging the OLED10 to be packaged, the OLED10 to be packaged includes a substrate 1, an OLED layer 2, a thin film packaging layer 4, a color filter 3, and a cover plate that are stacked in sequence 5 and the encapsulation glue 6 filled between the cover plate 5 and the substrate 1, the encapsulation device 20 includes an upper pressing plate 30 disposed above the covering plate 5 and a lower pressing plate disposed below the substrate 1 40, the lower platen 40 is provided with an ultrasonic sensor 50;
[0040]S21, the joint surface between the substrate 1 and the encapsulant 6 is the first interface 106, the joint surface between the cover plate 5 and the encapsulant 6 is the second interface 506, on the packaging device 20 Set the first preset value P1 and the second preset value P2, place the OLED...
Embodiment 2
[0051] see figure 2 and Figure 4 Shown, a kind of OLED encapsulation method comprises the steps:
[0052] S12, provide the OLED10 to be packaged and the packaging device 20 for packaging the OLED10 to be packaged, the OLED10 to be packaged includes a substrate 1, an OLED layer 2, a thin film packaging layer 4, a color filter 3, and a cover plate that are sequentially stacked 5 and the encapsulation glue 6 filled between the cover plate 5 and the substrate 1, the encapsulation device 20 includes an upper pressing plate 30 disposed above the covering plate 5 and a lower pressing plate disposed below the substrate 1 40, the lower platen 40 is provided with an ultrasonic sensor 50;
[0053] S22, the joint surface between the substrate 1 and the encapsulant 6 is the first interface 106, the joint surface between the cover plate 5 and the encapsulant 6 is the second interface 506, on the packaging device 20 Setting a second preset value P2, placing the OLED 10 to be packaged in...
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Abstract
The invention provides an OLED encapsulation method, comprising the following steps: S11, providing an OLED to be encapsulated and an encapsulation device, the OLED to be encapsulated includes a substrate, an OLED layer, a thin film encapsulation layer, a color filter, a cover plate, and encapsulation glue, and the encapsulation device It includes an upper platen and a lower platen, and the lower platen is provided with an ultrasonic sensor; S21, the joint surface between the substrate and the encapsulant is the first interface, and the joint surface between the cover plate and the encapsulant is the second interface, and the first preset value is set and the second preset value; S31, the ultrasonic sensor emits ultrasonic wave A, when the ultrasonic wave A is transmitted to the first interface, a first echo is generated, and when the ultrasonic wave A is transmitted to the second interface, a second echo is generated; S41 , calculate the distance between the first boundary surface and the second boundary surface; S51, when the distance between the first boundary surface and the second boundary surface is a second preset value, the upper platen stops moving. Such operation realizes the real-time monitoring of the thickness of the encapsulation glue, which is beneficial to realize the automation and standardization of the encapsulation process.
Description
technical field [0001] The invention relates to the technical field of organic photoelectric devices, in particular to an OLED packaging method. Background technique [0002] When ultrasonic waves enter another propagation medium from one propagation medium, part of the wave will be reflected back to the original medium by the interface of the medium, which is called reflected wave (or echo); while the other part can enter the next propagation medium Continue to propagate in the medium, but its propagation direction will be changed, which is called refracted wave or transmitted wave. [0003] OLED (Organic Light-Emitting Diode, Organic Light-Emitting Diode) device has excellent performance such as fast response speed, wide viewing angle, high brightness, low power consumption, etc., and is a self-luminous device. It is considered to be a next-generation display technology with great development prospects. . [0004] Silicon-based microdisplay is a high PPI (Pixels Per Inch...
Claims
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Application Information
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