Circuit substrate and display device

A circuit substrate and substrate technology, applied in the directions of printed circuits, printed circuit components, electrical components, etc., can solve problems such as expansion and offset, achieve expansion and contraction compensation, solve inaccurate alignment or wrong contact, and large contact area. Effect

Active Publication Date: 2018-08-10
WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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Problems solved by technology

[0003] At present, the main application of flexible display is COF (Chip On Film, chip-on-film) technology. Taking the double-layer COF structure as an example, in the traditional COF design, when the pin terminals are in COF Bonding (bonding process), expansion deviation is easy to occur. transfer phenomenon

Method used

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Embodiment Construction

[0017] The following will clearly and completely describe the technical solutions in the embodiments of the application with reference to the drawings in the embodiments of the application. Apparently, the described embodiments are only part of the embodiments of the application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0018] The terms "first", "second", and "third" in the embodiments of the present application are used for description purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of indicated technical features. Thus, features defined as "first", "second", and "third" may explicitly or implicitly include at least one of these features. In the description of the present application, "plurality" means at least two, such a...

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PUM

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Abstract

The invention discloses a circuit substrate. The circuit substrate comprises a substrate and pin terminals arranged on the substrate, and the pin terminals are arranged along the length direction to form a pin terminal array; and the contact area between at least part of the pin terminals positioned in the two ends of the array and the substrate is greater than that between the pin terminals positioned in the middle and the substrate. Thus, the pin terminals with inaccurate alignment due to offset, caused by technologies of the circuit substrate, of the pin terminals can be compensated.

Description

technical field [0001] The application relates to the field of circuit board pin structures, in particular to a circuit substrate and a display device. Background technique [0002] With the development of display technology, flexible display technology is the future development trend. [0003] At present, the main application of flexible display is COF (Chip On Film, chip-on-film) technology. Taking the double-layer COF structure as an example, in the traditional COF design, when the pin terminals are in COF Bonding (bonding process), expansion deviation is easy to occur. shift phenomenon. Contents of the invention [0004] The technical problem mainly solved by this application is to provide a circuit substrate and a display device capable of compensating for the inaccurate alignment of the pin terminals caused by the offset of the pin terminals due to the process of the circuit substrate. [0005] In order to solve the above technical problems, a technical solution ad...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/11
CPCH05K1/118
Inventor 肖友伟
Owner WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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