Wiring structure of printed circuit board

Abstract

The invention relates to the technical field of an integrated circuit, in particular to a wiring structure of a printed circuit board. The wiring structure is applied to a dual-layer printed circuit board and comprises a plurality of first signal lines, a plurality of first ground lines, a plurality of second signal lines and a plurality of second ground lines, wherein each first signal line and each first ground line are arranged at a top layer in parallel and extend along a first direction, each second signal line and each second ground line are arranged at a bottom layer in parallel and extend along a second direction different from the first direction, the first signal lines and the first ground lines are arranged at the top layer at intervals according to a first preset mode, the second signal lines and the second ground lines are arranged at the bottom layer at intervals according to the second preset mode, and the first ground lines and the second ground lines are connected through via holes in the printed circuit board. By the wiring structure, the situation that a ground line environment is damaged caused by connection line crossing can be prevented, meanwhile, the impedance environment of the signal lines is ensured, and the performance of a circuit on the printed circuit board is ensured under the condition that the cost is not increased.

Description

technical field [0001] The invention relates to the technical field of integrated circuits, in particular to a wiring structure of a printed circuit board. Background technique [0002] PCB (Printed Circuit Board, PCB for short) is an important electronic component, a support for electronic components, and a carrier for electrical connections of electronic components. [0003] Printed circuit boards have developed from single-layer to double-sided, multi-layer and flexible, and still maintain their own development trends. Due to the continuous development in the direction of high precision, high density and high reliability, continuous reduction in size, cost reduction and performance improvement, printed boards still maintain strong vitality in the development of future electronic equipment. [0004] The cost of double-layer printed circuit boards is low, but it is easy to generate high impedance, especially when different connections need to cross, which will destroy the ...

AI Technical Summary

Problems solved by technology

[0004] The cost of double-layer printed circuit boards is low, but it is easy to generate high impedance, especially when different connections need to cross, which will destroy the ground environment formed by the ground wire, and may also destroy the impedance environment of the signal line at the same time. leading to a decrease in the performance of the formed device

Images