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Computer heat dissipation frame

A heat dissipation rack and computer technology, applied in the computer field, can solve the problems that the cooling effect of the fan cannot be determined in real time, and achieve the effect of avoiding crashes or restarts and simple structure

Inactive Publication Date: 2018-08-17
郑州易通众联电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are the following problems in the heat dissipation system of the prior art: 1. the fan is fixedly installed in the chassis, and can only be fixed to cool down a part of the chassis
②When the indoor temperature is too high, the temperature inside the chassis will increase, and it is impossible to determine the cooling effect of the fan on the cooling part in real time

Method used

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  • Computer heat dissipation frame
  • Computer heat dissipation frame

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Embodiment Construction

[0014] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0015] like Figure 1~Figure 2 Shown, a kind of computer radiator, its composition comprises: shell, and shell is installed on the shell of chassis through the threaded hole 14 of lower shell, and fan faces motherboard and CPU, and shell is made of upper shell 1 and lower shell Body 2, the shell is a cuboid structure, the upper shell 1 and the lower shell 2 are connected by screws 3, the upper shell 1 can prevent the equipment in the ...

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PUM

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Abstract

The invention provides a computer heat dissipation frame. The computer heat dissipation frame comprises an upper housing and a lower housing, the upper housing and the lower housing are connected through screws, fixing bases are arranged at three corners of the lower housing respectively, and a first motor is arranged at another corner of the lower housing. A first sliding rod is arranged betweenthe fixing bases on the same side, a first lead screw is arranged between the fixing base and the first motor, and a moving frame is further arranged between the first lead screw and the first slidingrod and provided with a second motor and a sliding rod. The second motor drives a second lead screw, a fan frame is arranged between the second lead screw and the second sliding rod, and at least oneheat dissipation fan is installed on the fan frame. The computer heat dissipation frame has the advantages that through arrangement of sliding ducts in X and Y directions, the heat dissipation fans can perform targeted and timely heat dissipation on high temperature parts, and the computer crash or restart due to too high temperature of a machine box can be avoided.

Description

technical field [0001] The invention relates to the field of computers, in particular to a cooling rack for computers. Background technique [0002] With the development and progress of society, computers have become a necessity in life. Regardless of work and life, you can see the shadow of computers everywhere. The core components in a computer usually include multiple heat-generating components such as a CPU, a power supply, and a hard disk. When people use computers to operate some large-scale programs or play some large-scale games, the computer will generate a lot of heat due to the increase in the amount of calculations. At this time, the cooling system of the computer is needed to discharge the heat. Slowness, freezes, and even burnt vital components. [0003] The computer heat dissipation system in the prior art usually includes a radiator and a fan corresponding to the radiator. Mouth discharge. However, there are the following problems in the heat dissipation...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
CPCG06F1/20
Inventor 徐立刚
Owner 郑州易通众联电子科技有限公司