Wide-band vertical interdigital capacitor of novel structure

Abstract

The invention discloses a wide-band vertical interdigital capacitor of a novel structure. The capacitor adopts low-temperature co-fired ceramic as a base and is designed to be of an eight-layer squarestructure; the capacitor is the vertical interdigital capacitor and is composed of eight sections of interdigitated fingers, that is to say, each layer of the eight-layer square structure is a section of interdigitated fingers, and all the sections of interdigitated fingers are located at the first to eighth layers respectively; a first port and a second port are formed in the centers of the twoopposite side surfaces of the interdigitated fingers respectively; vertical through holes are formed in the right ends of the first port and the second port; in the direction of the first port, open circuit ends of interdigital capacitor bodies at the second, fourth, sixth and eighth sections are connected through the corresponding vertical through holes; in the direction of the second port, opencircuit ends of interdigital capacitor bodies at the first, third, fifth and seventh sections are connected through the corresponding vertical through holes. The wide-band vertical interdigital capacitor (WBVIC) of the novel structure suppresses strays in frequency responses and increases the bandwidth by 100%. Meanwhile, the capacitance capacity is increased by 20%, but the Q value is not reduced.

Description

technical field [0001] The invention relates to a broadband vertical interdigital capacitor with a novel structure, which belongs to the field of electronic devices. Background technique [0002] Traditional Vertical Interdigital Capacitance (VIC) is often used to make lumped filters or couplers on multilayer substrates because of its large capacitance, high Q value, and small size. [0003] Typically, lower application frequencies tend to result in greater capacitive capacity requirements. The capacitive capacity of the vertical finger capacitor can be increased by increasing its size or the number of fingers. However, increasing the area of ​​the fingers is contradictory to reducing the overall size of the capacitor, and increasing the number of fingers will lead to unwanted resonance or spurious spurs that we do not want to appear, thereby limiting the usable frequency band. [0004] Since the vertical interdigitated capacitor is a multi-conductor structure, the multi-f...

AI Technical Summary

Problems solved by technology

All vertical interdigitated capacitors have this problem in design and production. At present, gold wire bonding is used to connect non-adjacent open ends to eliminate strays in the industry. However, because the interdigitated fingers are packaged into a multi-layer substrate, this This method is not suitable for interdigitated capacitors

The vias and defect structures in the vertical interdigitated capacitors are designed to eliminate unwanted stray spikes, but the structure of this capacitor is too complex to be suitable for the production field

Images