A full bonding process of a display module with an outer frame
A display, full-fit technology, applied in the input/output process of instruments, data processing, identification devices, etc., can solve the problems of panel or protective panel bonding, display module incompatibility, etc., to achieve the effect of enhancing toughness
Active Publication Date: 2020-11-06
深圳全息界科技有限公司
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Problems solved by technology
[0004] The technical problem to be solved by the present invention is to provide a full bonding process of a display module with a frame. This process is not prone to glue overflow during the bonding process, and solves the problem that a large-sized display module cannot be attached to a panel or a protective panel. It can fill the height difference between the outer frame of the display module and the display area, and enhance the toughness of the display module and the panel as well as the bonding force between the two
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[0028] The idea, specific structure and technical effects of the present invention will be clearly and completely described below in conjunction with the embodiments and accompanying drawings, so as to fully understand the purpose, features and effects of the present invention. Apparently, the described embodiments are only some of the embodiments of the present invention, rather than all of them. Based on the embodiments of the present invention, other embodiments obtained by those skilled in the art without creative efforts belong to The protection scope of the present invention. In addition, all the connection / connection relationships involved in the patent do not simply refer to the direct connection of components, but mean that a better connection structure can be formed by adding or reducing connection accessories according to specific implementation conditions. The various technical features in the present invention can be combined interactively on the premise of not co...
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The invention relates to a full lamination process for a display module with an outer frame. The full lamination process comprises the following steps: carrying out dispensing, carrying out curing onthe dispensing position, attaching a thermoplastic glue film, attaching optical cement to the lower surface of a panel, laminating the panel covered by the optical cement with the display module, carrying out hot-pressing on the display module and the panel, carrying out defoaming treatment on the display module and the panel, detecting the laminating state of the display module and the panel, andcarrying out curing. With the full lamination process for the display module with the outer frame, the problem that the display module with large size can not realize lamination with the panel is solved, the height difference between the outer frame of the display module and the display area is filled up by utilizing the thermoplastic glue film, the optical cement is added between the display module and the panel, the display module and the panel are relatively fixed due to curing, on one hand, the height of the outer frame of the display module is made up, on the other hand, the toughness ofthe display module and the panel and the bonding power between the display module and the panel are enhanced.
Description
technical field [0001] The invention relates to the technical field of display module film sticking, in particular to a full bonding process of a display module with an outer frame. Background technique [0002] Display modules currently on the market generally have a protective panel or a touch panel attached to the surface of the display module, and a layer of solid optical adhesive, such as OCA, or point Apply a layer of liquid optical glue, such as OCR, by setting an adhesive between the display module and the protective panel or the touch panel, and fix the display module and the protective panel or the touch panel by curing. [0003] However, the existing solid-state optical glue cannot be used for laminating large-sized display modules. When there is a height difference between the outer frame of the display module and the display area, the height difference cannot be compensated. During the process, glue overflow is prone to occur, and the equipment cost is high, an...
Claims
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IPC IPC(8): G09F9/00G06F3/041
CPCG06F3/0412G06F2203/04103G09F9/00
Inventor 陈波
Owner 深圳全息界科技有限公司