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Radiation-sensitive resin composition, resist pattern forming method, and acid diffusion controlling agent

A technology of resin composition and radiation, which is applied in the field of acid diffusion control agent and radiation sensitive resin composition, can solve the problems of insufficient storage stability and achieve PEB shrinkage inhibition and storage stability, small LWR, resolution high rate effect

Active Publication Date: 2021-10-19
JSR CORPORATIOON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, the above-mentioned conventional radiation-sensitive resin composition containing an acid diffusion control agent has the disadvantage of insufficient storage stability due to its alkalinity.

Method used

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  • Radiation-sensitive resin composition, resist pattern forming method, and acid diffusion controlling agent
  • Radiation-sensitive resin composition, resist pattern forming method, and acid diffusion controlling agent
  • Radiation-sensitive resin composition, resist pattern forming method, and acid diffusion controlling agent

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0373]

[0374] This radiation-sensitive resin composition can be prepared by, for example, [A] polymer, [B] acid generator, [C] compound, and if necessary, [D] polymer, [E] solvent, and other optional components. The ratio is mixed, and the obtained mixed solution is preferably prepared by filtering, for example, through a filter with a pore size of about 0.2 μm. The lower limit of the solid content concentration of the radiation-sensitive resin composition is preferably 0.1% by mass, more preferably 0.5 parts by mass, and still more preferably 1% by mass. The upper limit of the solid content concentration is preferably 50% by mass, more preferably 30% by mass, and still more preferably 20% by mass.

[0375] This radiation-sensitive resin composition can be used for positive pattern formation using an alkaline developing solution, and can also be used for negative pattern formation using a developing solution containing an organic solvent. Among them, when used for negativ...

Embodiment

[0395] Hereinafter, the present invention will be specifically described based on examples, but the present invention is not limited to these examples. The measurement methods of various physical property values ​​are shown below.

[0396] [Weight average molecular weight (Mw), number average molecular weight (Mn) and degree of dispersion (Mw / Mn)]

[0397] Mw and Mn of the polymer were measured by gel permeation chromatography (GPC) using Tosoh GPC columns (two "G2000HXL", one "G3000HXL", and one "G4000HXL") under the following conditions. In addition, the degree of dispersion (Mw / Mn) was calculated from the measurement results of Mw and Mn.

[0398] Elution solvent: tetrahydrofuran

[0399] Flow: 1.0mL / min

[0400] Sample concentration: 1.0% by mass

[0401] Sample injection volume: 100μL

[0402] Column temperature: 40°C

[0403] Detector: Differential refractometer

[0404] Standard material: monodisperse polystyrene

[0405] [ 1 H-NMR analysis and 13 C-NMR analys...

Synthetic example 1

[0410] [Synthesis Example 1] (Synthesis of Compound (C-1))

[0411] 2.08g (10mmol) of 9,10-phenanthrenequinone, 2.75g (15mmol) of 3,4,5-trimethoxyaniline, 2.54g (10mmol) of 2-trifluoromethanesulfonyloxybenzaldehyde, and 3.85g of ammonium acetate (50 mmol) and 100 mL of acetic acid were put into a reaction vessel, heated to 110° C. and stirred for 4 hours. Next, acetic acid was removed under reduced pressure, and 50 mL of ethyl acetate and 50 mL of saturated aqueous sodium bicarbonate solution were added for liquid separation. The organic layer was dried over anhydrous sodium sulfate, filtered, and the solvent was distilled off. Purification was carried out by silica gel column chromatography to obtain compound (C-1) (yield 4.43 g, yield 73%).

[0412]

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PUM

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Abstract

The present invention is a radiation-sensitive resin composition comprising a first polymer, a radiation-sensitive acid generator, and a first compound, the first polymer having a first structural unit containing an acid dissociable group, and the first compound Salts can be formed by structural changes in molecules by irradiation with radiation. The above-mentioned first compound is preferably a compound whose basicity is changed by irradiation with radiation. It is preferable that the said 1st compound is a compound which produces|generates an acid by irradiation with radiation. The above-mentioned first compound is preferably represented by the following formula (1). In the following formula (1), Ar 1 It is a substituted or unsubstituted heteroaromatic hydrocarbon diyl group having 4 to 30 ring members containing at least one nitrogen atom as a ring constituent atom.

Description

technical field [0001] The present invention relates to a radiation-sensitive resin composition, a resist pattern forming method, and an acid diffusion controller. Background technique [0002] The radiation-sensitive resin composition used in the microfabrication of photolithography generates acid in the exposed part when it is irradiated with radiation such as electromagnetic waves and charged particle beams, and the exposed part and the unexposed part are separated by a chemical reaction using the acid as a catalyst. The dissolution rate in the developer is different, and a resist pattern is formed on the substrate. [0003] At present, the use of laser or electron beams with shorter wavelengths, liquid immersion exposure equipment, etc., can realize the miniaturization of resist pattern processing technology. For the above-mentioned radiation-sensitive resin composition, not only the resolution of the formed resist pattern is excellent, but also optical properties such ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/004C08F220/28G03F7/038G03F7/039G03F7/20
CPCC08F2/48C08F220/22G03F7/0397C07D235/02C07D235/18C08F220/16C08F2800/10G03F7/0045C08F220/1809C08F220/1807C08F220/283C08F220/1806C08F220/1812C08F220/1811C08F220/1818C08F220/281C08F220/1808G03F7/004G03F7/0048G03F7/038G03F7/039G03F7/20G03F7/26C08F220/28C07D233/64G03F7/30G03F7/162G03F7/168G03F7/2006G03F7/2041G03F7/322G03F7/38
Inventor 木下奈津子
Owner JSR CORPORATIOON