79 results about "Exposure latitude" patented technology

A chemical amplification type positive resist composition comprising: a resin which has a hydroxystyrene-based polymerization unit, a 3-hydroxy-1-adamantyl methacrylate-based polymerization unit and a polymerization unit having a group unstable toward an acid, and, though insoluble or hardly soluble in an alkali in itself, becomes alkali-soluble after the acid-unstable group has been cleaved by the action of an acid; and an acid generating agent is provided. This resist composition is improved in exposure latitude and resolution. Moreover, such properties as sensitivity, heat resistance, the ratio of residual thickness, coatability, and dry etching resistance are also maintained good. Thus, through the use of this composition, a fine resist pattern can be formed with high precision.

A rectangular or bar-shaped, on-axis illumination mask with radiation polarized parallel to the length of the bar provides improved DOF and exposure latitude with less lens heating as compared to a circular monopole with equivalent σ.

A heat-sensitive lithographic printing plate precursor is disclosed which comprises a hydrophilic support and an oleophilic coating thereon which comprises an infrared light-to-heat converter, an alkali-soluble binder and a polymeric developer accelerator. The polymeric developer accelerator is preferably a phenolic formaldehyde resin comprising at least 70 mol % of meta-cresol as recurring unit or at least 40 mol % of monohydroxy benzene cresol as recurring unit. The PDA may also be a phenolic resin which comprises at least 5 mol % of a recurring monomeric unit having at least one phenolic hydroxyl group and at least one alkali solubilising group. The polymeric developer accelerator improves the sensitivity while maintaining a good under-exposure latitude and a good developer resistance of the printing plate.

Provided is a method of forming a pattern and an actinic-ray- or radiation-sensitive resin composition that excels in the limiting resolving power, roughness characteristics, exposure latitude (EL) and bridge defect performance. The method of forming a pattern includes (1) forming an actinic-ray- or radiation-sensitive resin composition into a film, (2) exposing the film to light, and (3) developing the exposed film with a developer containing an organic solvent. The actinic-ray- or radiation-sensitive resin composition contains (A) a resin containing a repeating unit with a structural moiety that is configured to decompose when exposed to actinic rays or radiation to thereby generate an acid, and (B) a solvent.

A polymer is prepared by radical polymerization of a monomer using an organotellurium or organoselenium compound as a polymerization initiator. The polymer has a narrower dispersity Mw/Mn and is adequately random. A resist composition comprising the polymer as a base resin has advantages including a dissolution contrast of resist film, high resolution, exposure latitude, process flexibility, good pattern profile after exposure, and minimized line edge roughness.

With improved DUV photoresist and bottom resin, this invention can decrease photoresist thickness to less than 0.11ª–m for safe height-width ratio to improve picture resolution and size evenness, exposure tolerance and focusing depth of key parts, and reduces cost.

The present invention provides a plate burning process of a precise screen. The process employs a way of secondary exposure way to complete the film graphic transfer to the screen, and specifically comprises steps of: A) film production: first compensating the film, then adding composing and positioning to ensure a composing position deviation no more than 100 mum in a secondary plate burning of the screen; B) plate burning: carrying out composing and plate burning according to composing position required by printing, wherein the first plate burning energy set value is a minimum value of the exposure latitude, and the secondary plate burning energy value is set at a peak value of the optimum exposure. The method of the invention employs a parallel light plate burning machine to achieve clear text and effectively control edge jag and side virtual exposure; meanwhile, as the screen is treated with exposure for two times, the exposure energy is sufficient, and the pressrun of the screen film is improved.

The invention relates to a positive lithograph plate photosensitive composition with high resolution and high sensitivity. The photosensitive composition provided by the invention is characterized by comprising at least one of three-structure antihalation compounds, uses 215 diazonaphthoquinone sulphonate and 214 diazonaphthoquinone sulphonate jointly, and has one or more of linear phenolicresin, one photoacid generator, one or more of development accelerator, one background dye and the like. The photosensitive lithograph plate manufactured by the photosensitive composition has the characteristics of rapid photosensitive speed, high resolution, large exposure latitude, good weak base development performance, higher pressrun and the like, and the plate is suitable for UV-CTP platemaking.

A photosenstive resin composition is prepared by dispersing at least one of a hydrophobic polymer and a mixture of an oil-soluble photopolymerization initiator and a water-insoluble or sparingly water-soluble compound having at least one photoactive, ethylenically unsaturated group in an aqueous solution that contains both a water-soluble polymer and a diazo resin is obtained by condensing a water-soluble salt of an optionally substituted 4-diazodiphenylamine with formaldehyde in the presence of sulfuric acid and phosphoric acid. This photosensitive resin composition gives a photosensitive film having excellent stability over time and a wide exposure latitude. By adding a specific fluorine compound to the photosensitive resin composition, a screen plate has an excellent discharge performance.

A reverse pattern is formed once by combining a negative exposure mask having a wiring pattern with a positive resist, and then a positive wiring pattern is formed by use of the reverse pattern. That is, a positive resist applied on a semiconductor substrate is exposed by use of the exposure mask having an opening part in a region corresponding to the wiring pattern, and then the exposed part is removed by development to form a resist pattern, thereby forming the wiring pattern in the region corresponding to the opening part of the resist pattern. Consequently, it is hardly affected by flare during EUV exposure, thereby fabricating a fine wiring pattern with higher exposure latitude.

Provided is a positive resist material, particularly a chemically amplified positive resist material having higher sensitivity, higher resolution, a higher exposure latitude and better process adaptability than conventional positive resist materials, and providing a good pattern profile after exposure, particularly having lessened line edge roughness and exhibiting excellent etching resistance. These materials may contain, preferably an organic solvent and acid generator, more preferably a dissolution inhibitor or a basic compound and/or a surfactant. Provided is a positive resist material comprising a polymer comprising at least one monomer unit selected from a group consisting of a monomer unit (A), a monomer unit (B) and a monomer unit (C) represented by the following formula (1); and having a glass transition temperature (Tg) of 100° C. or greater.

Provided is a method of forming a pattern, ensuring excellent exposure latitude (EL) and focus latitude (depth of focus DOF). The method of forming a pattern includes (A) forming a film from a resist composition, the resist composition, (B) exposing the film to light, and (C) developing the exposed film using a developer containing an organic solvent, thereby forming a negative pattern. The resist composition contains (a) a resin that is configured to decompose when acted on by an acid and ΔSP thereof represented by formula (1) below is 2.5 (MPa)^1/2 or above, (b) a compound that is composed to generate an acid when exposed to actinic rays or radiation, and (c) a solvent.

ΔSP=SP_F−SP_I  (1)

The object of the invention is to solve the problems in the related art, and to provide a photosensitive lithographic printing plate which is processable for image formation thereon with argon ion laser, FD-YAG laser, violet laser or the like, which has high sensitivity, which satisfies both the requirement of staining resistance in printing and the requirement of printing durability, and which has good developability, good ink acceptability, good image formability and broad exposure latitude.

A method for making a lithographic printing plate includes the steps of: (1) providing a heat-sensitive lithographic printing plate precursor including on a support having a hydrophilic surface or which is provided with a hydrophilic layer, a heat-sensitive coating, (2) image-wise exposing the precursor with IR-radiation or heat, and (3) developing the image-wise exposed precursor with an alkaline developing solution including a compound having at least two onium groups. According to the above method, a printing plate is formed with an improved developing latitude or an improved exposure latitude.

An object of the present invention is to provide an actinic-ray-sensitive or radiation-sensitive resin composition which is significantly excellent in terms of exposure latitude, is capable of forming a favorable rectangular pattern profile, and exhibits low dissolution of the components into an immersion liquid when performing immersion exposure, and a resist film and a pattern forming method each using the same composition. The actinic-ray-sensitive or radiation-sensitive resin composition contains (A) a compound represented by formula (I) and capable of generating an acid upon irradiation of actinic-rays or radiations, and (B) a resin capable of increasing the solubility in an alkaline developer by the action of an acid.

Provided is an active light-sensitive or radiation-sensitive resin composition with excellent exposure latitude and pattern roughness such as line width roughness, and a pattern-forming method using the same. The active light-sensitive or radiation-sensitive resin composition of the present invention contains

• • (A) at least one type of a compound which is represented by General Formula (I) below and which generates an acid by irradiation with active light or radiation and
  • (B) at least one type of a resin which includes a repeating unit which is represented by General Formula (1) below and of which, due to being decomposed by an action of an acid, the solubility increases with respect to an alkali developer.