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Electrowetting device and manufacturing method thereof

A manufacturing method and electrowetting technology, applied in the field of electrowetting, can solve the problems of large amount of packaging glue, pollution and waste of the display area, and achieve the effect of improving product quality and reliability, increasing the display area, and improving stability

Pending Publication Date: 2018-08-31
SOUTH CHINA NORMAL UNIVERSITY +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In order to solve the above technical problems, the present invention provides an electrowetting device and its manufacturing method, which can solve the problem that the existing electrowetting device is packaged with an encapsulation frame, which is difficult to achieve precise control and affects the performance of the display device; the amount of encapsulation glue is large, Cause waste; and the encapsulation glue is easy to deform during the pressing process, which will pollute the display area and reduce the visible area of ​​the display device.

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  • Electrowetting device and manufacturing method thereof
  • Electrowetting device and manufacturing method thereof

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Embodiment Construction

[0024] The conception, specific structure and technical effects of the present invention are clearly and completely described below in conjunction with the embodiments and accompanying drawings, so as to fully understand the purpose, scheme and effect of the present invention. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0025] The descriptions of upper, lower, left, right, etc. used in the present invention are only relative to the mutual positional relationship of the various components of the present invention in the drawings, and the terms "comprising" and "having" and any deformation thereof are intended to cover not exclusive inclusion.

[0026] Reference ...

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Abstract

The invention discloses an electrowetting device and a manufacturing method thereof. The electrowetting device comprises an upper substrate, a lower substrate and a packaging structure, wherein the upper and lower substrates are oppositely arranged and are sealed and closed through a packaging structure to form a sealed cavity; packaging liquid fills the sealed cavity; the packaging structure comprises a rigidity packaging supporting structure and packaging glue. According to the device, a manner in which the rigidity packaging structure and the packaging glue are combined is adopted by the packaging structure of the electrowetting device, and the using amount of the packaging glue can be effectively reduced to prevent the packaging glue from being massively deformed during the pressing process resulting in the pollution of a displaying area, so that the size of the packaging structure can be controlled more precisely, the displaying area of a device is greatly increased, and the quality, reliability and stability of products are improved.

Description

technical field [0001] The invention relates to the field of electrowetting, in particular to an electrowetting device and a manufacturing method thereof. Background technique [0002] Electrowetting refers to the phenomenon of changing the wettability of a droplet on a substrate (that is, changing the contact angle) by changing the voltage between the liquid and the insulating substrate, so that the droplet deforms and moves. The electrowetting display device was first developed by Liquavista, a professional display manufacturer under Philips, and its research results were published in the journal "Nature" in 2003. Electrowetting display devices usually consist of upper and lower structural layers. The upper structural layer is composed of an upper substrate, a conductive layer, a support column and a sealant frame, and the lower structural layer is composed of a lower substrate, a conductive layer, a hydrophobic insulating layer, and weakly hydrophilic pixels. wall compos...

Claims

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Application Information

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IPC IPC(8): G02B3/14G02B26/02
CPCG02B26/02G02B3/14
Inventor 唐彪董宝琴蒋洪伟艾利克斯·汉森·维克多周国富
Owner SOUTH CHINA NORMAL UNIVERSITY