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Substrate grinding device and grinding method thereof

A technique for grinding devices and substrates, which is applied in the direction of grinding devices, grinding machine tools, grinding machines, etc., and can solve problems such as poor grinding effect, low grinding precision, and low grinding efficiency

Active Publication Date: 2018-09-14
KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Based on this, it is necessary to provide a substrate grinding device and a grinding method thereof for the problems of low grinding efficiency, low grinding precision and poor grinding effect of the above-mentioned traditional grinding technology.

Method used

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  • Substrate grinding device and grinding method thereof
  • Substrate grinding device and grinding method thereof
  • Substrate grinding device and grinding method thereof

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Experimental program
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Embodiment Construction

[0029] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0030] During the manufacturing process of the display panel, some raised defects formed by air bubbles, surface particles or other foreign matters may be generated on the surface of the substrate. In order to avoid more serious defects caused by the bumps in the subsequent process, such as the explosion of bubbles in the high-temperature process, the grinding repair technology is generally used to grind the bumps so that the height of the bumps after grinding is less than or equal to the preset standard value, even if the bumps after grinding are within the acceptable height range. An embodiment of the present invention provides a substrate grinding device, which can grind the protrusions on the substrate during the manufacturing proc...

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PUM

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Abstract

The invention relates to a substrate grinding device. The substrate grinding device comprises a grinding part and a control part, wherein the grinding part comprises a plurality of grinding heads withdifferent preset grinding height ranges to grind bumps of corresponding heights; the grinding accuracies of the grinding heads with larger grinding heights are lower than the grinding accuracies of the grinding heads with smaller grinding heights, and the grinding speeds of the grinding heads with greater grinding heights are higher than the grinding speeds of the grinding heads with smaller grinding heights; the control unit is connected with the grinding part, and is used for receiving the real-time heights of the bumps in a grinding process and controlling corresponding grinding heads to grind the bumps according to the real-time heights of the bumps. The invention further relates to a control method. The control method comprises the following steps: receiving the real-time heights ofthe bumps; determining preset grinding height ranges corresponding to the real-time heights; controlling corresponding grinding heads to start grinding the bumps according to the preset grinding height ranges. The substrate grinding device and the control method thereof have higher grinding efficiency and better grinding effect.

Description

technical field [0001] The invention relates to the technical field of display panel repair, in particular to a substrate grinding device and a grinding method thereof. Background technique [0002] Flexible display is one of the highlights of AMOLED, and more and more manufacturers are investing in the field of flexible display. The manufacturing process of the flexible panel is relatively complicated. During the manufacturing process of the flexible panel, some foreign objects may protrude on the surface of the flexible panel. In order to prevent these protrusions from causing more serious defects in the subsequent manufacturing process, the grinding repair technology is generally used to grind the protrusions so that the height of the protrusions after grinding is within the preset standard range. [0003] The existing grinding technology firstly measures the height of the protrusion, then grinds, and then measures the height after grinding. If the raised height after g...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/10B24B37/00B24B37/34B24B49/00B24B27/00
CPCB24B27/0076B24B37/005B24B37/10B24B37/34B24B49/006
Inventor 高文龙
Owner KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD