Partition alignment method of via hole layers and circuit pattern layers

Abstract

The invention discloses a partition alignment method of via hole layers and circuit pattern layers. The method comprises the following steps: forming a rectangular PCB jointed board, ensuring that a plurality of PCB shipment units with the same sizes are distributed on the PCB jointed board, and ensuring that the area outside the positions of the PCB shipment units on the PCB jointed board servesas a border area; respectively designing a plurality of partition center positioning targets and partition pattern positioning targets on the edge of the border area; obtaining coordinate values of all the partition center positioning targets and partition pattern positioning targets before expansion and contraction; machining the PCB jointed board; obtaining coordinate values of center points ofall the shipment units after expansion and contraction; obtaining sizes of all the shipment units after expansion and contraction; generating program data of a plurality of via hole layers forming one-to-one correspondence with all the shipment units; and machining all the via hole layers onto the PCB jointed board in an alignment manner according to the program data of the via hole layers.

Description

technical field [0001] The invention belongs to the field of printed circuit board manufacturing, and more specifically relates to a partition alignment method for a via hole layer and a circuit pattern layer. Background technique [0002] With the development of science and technology, the functions of electronic products are becoming more and more abundant, so the requirements for the refinement of printed circuit boards (PCBs) are also getting higher and higher. Such as figure 1 As shown, the PCB generally includes a via layer (laser-processed hole layer H2 and mechanically-processed hole layer H1 that are conductive after copper plating) and a circuit layer. The alignment accuracy of the via layer and the circuit layer directly determines the PCB Board product performance. Therefore, major PCB board manufacturers have invested a lot of manpower and material resources to improve the alignment process level between the via hole layer and the circuit layer. [0003] On t...

AI Technical Summary

Problems solved by technology

However, due to the inconsistency between the expansion and contraction ratio of the via hole layer and the circuit layer (the PCB board will change in size due to temperature changes during the production process), the existing alignment processing method of the panel is adopted, and the alignment of the PCB board is completed. Finally, there are the following significant defects: the alignment accuracy of PCB items near the center of the PCB panel is high (good product), while the contrast accuracy of PCB items near the edge of the PCB panel is very low (waste).

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