Floor support base plate and prepared technology and module type laying assembly

A technology for supporting the bottom plate and preparation process, applied in the direction of floor, building, building structure, etc., can solve the problems of unstable installation, long disassembly and assembly time, etc., and achieve the effect of stable connection

Active Publication Date: 2018-09-18
江苏创森新材料有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the existing assembled floors have problems such as unstable installation and long disassembly time.

Method used

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  • Floor support base plate and prepared technology and module type laying assembly
  • Floor support base plate and prepared technology and module type laying assembly
  • Floor support base plate and prepared technology and module type laying assembly

Examples

Experimental program
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Effect test

Embodiment

[0041] The following is attached Figure 1-5 The present invention is described in further detail.

[0042] A floor support base such as Figure 1-4 As shown, it includes a rectangular plate-shaped floor body 1 and a circular plate-shaped lock plate 2, and the upper surface of the floor body 1 and the lock plate 2 are provided with a plurality of mushroom-shaped protrusions 15 in a rectangular array. Mushroom-shaped protrusions 15 are provided to facilitate fast lamination when the surface floor is laid after the floor body 1 is spliced. The diameter of the disc 21 is larger than that of the lower disc 22, and the lower surface of the upper disc 21 is provided with four limiting discs 23 in an array along its circumferential direction. Matching 1 / 4 round matching groove 11, the end of the lock plate 2 is located at the matching groove 11 position and extends with a 1 / 4 round connecting ring plate 12 that cooperates with the lower disc 22, the thickness of the connecting ring p...

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PUM

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Abstract

The invention discloses a floor support base plate and prepared technology thereof and a module type laying assembly. The floor support base plate includes a floor body and a fore shaft disk; a plurality of mushroom-shaped humps are arranged on the upper surface of the floor body and the upper surface of the fore shaft disk; the fore shaft disk includes an upper disk and a lower disk formed on thelower surface of the disk; the diameter of the upper disk is larger than the diameter of the lower disk and four limiting wafers are arranged on the lower surface, in the circumferential direction, of the upper disk in a arraying mode; a quarter round matching groove matched with the upper disk is formed in end portion of a fore shaft of the floor body; a quarter round ring adapter ring plate matched with the lower disk is extended on the end portion of the fore shaft disk located on the position of the matching groove and the thickness of the adapter ring plate is the same with the thicknessof the lower disk; a locking part clamped with one of the limiting wagers is arranged on the adapter ring plate and the upper surface of the floor body is matched with the upper surface of the upperdisk; the locking part matched with the limiting wafers is arranged on the adapter plate, so that fast fixing between the floor body and the fore shaft is achieved and fast splicing is completed.

Description

technical field [0001] The invention relates to the technical field of floor splicing, more specifically, it relates to a floor support base plate, its preparation process and a modular laying assembly. Background technique [0002] The new assembled floor has been recognized by more and more people because of its many advantages such as safety, environmental protection and disassembly at will. The new assembled floor is a very advanced and novel ground floor material for sports venues. [0003] However, existing assembled floors have problems such as unstable installation and long disassembly time. Contents of the invention [0004] In view of the deficiencies in the prior art, the purpose of the present invention is to provide a floor support bottom plate, which has the characteristics of fast installation, splicing and stability. [0005] To achieve the above object, the present invention provides the following technical solutions: [0006] A modular laying assembly, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): E04F15/02B29C45/00
Inventor 朱永书朱步宇高毅
Owner 江苏创森新材料有限公司
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