Diamond Wire Slicing Silicon Wafer Breaking Wire Entry Method

Abstract

The invention provides a feeding method for cutting a silicon wafer through a diamond wire after wire breaking, and belongs to the technical field of diamond wire cutting methods. The method comprisesthe following steps that (1) the thickness of a silicon block at the position where wire breaking occurs is measured after wire breaking occurs, and feeding treatment is carried out again on the silicon block with the diameter smaller than 40 mm; (2) the diamond wire is cut off, and the silicon block is lifted; (3) a wire unwinding shaft is demounted, the diamond wire is replaced, and a lead screw is fastened; (4) a cutting wire mesh is re-arranged, and a gap is treated; (5) the tension and the rotating speed of the cutting wire mesh are set, and cutting wire feeding through a fine diamond wire is carried out after the cutting gap is aligned; (6) the fine diamond wire is cut off after feeding is completed, and then the fine diamond wire is replaced by the original diamond wire with a large diameter, so that the two kinds of diamond wires are knotted, and the cutting wire mesh is turned in the forward direction and is pressed downwards to the cutting gap of the silicon wafer; and (7) amachine is started to operate. According to the feeding method for cutting the silicon wafer through the diamond wire after wire breaking, the silicon block with the silicon block thickness of smaller than 40 mm is subjected to feeding operation again, so that the technical problems that after wire breaking occurs during silicon block cutting, feeding is difficult, the silicon wafer is broken andthe cost is increased are solved.

Description

technical field [0001] The invention belongs to the technical field of diamond wire cutting methods, and more specifically relates to a diamond wire cutting method for inserting broken wires into silicon chips. Background technique [0002] The diamond wire cutting speed is fast. In order to make the diamond wire cut silicon wafers have a good quality, it is necessary to ensure that the equipment, material properties and operations are well coordinated. However, the diamond wire is unavoidable during the cutting process. , especially when there are many impurities in the polysilicon block, the general treatment method is to lift the block first, scrap the silicon block and reuse it as an ingot, but this method will greatly increase the loss of silicon wafers; Wired network enters the knife to deal with broken wires and reduce losses. Since the cutting gap after diamond wire breaks is small, it is difficult to enter the knife. Silicon wafer waste and cost increase problems. ...

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a diamond wire cutting method for cutting a broken silicon chip into a knife, so as to solve the problems existing in the prior art that the diamond wire is cut into a knife after a broken wire is difficult, resulting in broken silicon chips, wasting silicon chips, and increasing costs. question

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