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A kind of heat conduction structure and its preparation method, mobile terminal

A heat-conducting structure and heat-conducting layer technology, which is applied in the direction of semiconductor devices, semiconductor/solid-state device parts, liquid chemical plating, etc., can solve the problems of poor thermal conductivity of heat-conducting structures and achieve the effect of improving heat-conducting efficiency

Active Publication Date: 2020-03-10
VIVO MOBILE COMM CO LTD
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  • Abstract
  • Description
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Problems solved by technology

[0004] An embodiment of the present invention provides a heat conduction structure, which is used to solve the problem of poor thermal conductivity of the heat conduction structure in the prior art

Method used

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  • A kind of heat conduction structure and its preparation method, mobile terminal
  • A kind of heat conduction structure and its preparation method, mobile terminal
  • A kind of heat conduction structure and its preparation method, mobile terminal

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Embodiment Construction

[0022] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with specific embodiments of the present invention and corresponding drawings. Apparently, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0023] Such as figure 1 As shown, the heat conduction structure 100 of the present invention includes a first metal heat conduction layer 1 and a second metal heat conduction layer 2, the material of the second metal heat conduction layer 2 is different from that of the first metal heat conduction layer 1, and the second metal heat conduction layer 2 Electroplate...

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Abstract

The invention discloses a heat conduction structure, a preparation method thereof and a mobile terminal. The heat conduction structure comprises a first metal heat conduction layer and a second metalheat conduction layer different from the first metal heat conduction layer in material. The second metal heat conduction layer is plated on the outer side of the first metal heat conduction layer. Anopening for exposing the first metal heat conduction layer is arranged in the second metal heat conduction layer. According to the invention, the first metal heat conduction layer directly contacts the second metal heat conduction layer; the heat of the second metal heat conduction layer is more easily conducted to the first metal heat conduction layer; the first metal heat conduction layer is partially exposed; the heat conduction efficiency of the first metal heat conduction layer can be improved; and the heat conduction efficiency of the heat conduction structure is improved.

Description

technical field [0001] The present invention relates to the technical field of mobile terminals, in particular to a heat conduction structure, and also to a method for preparing the above heat conduction structure and a mobile terminal including the above heat conduction structure. Background technique [0002] With the continuous development of mobile phones, the degree of intelligence of mobile phones continues to increase, the configuration becomes higher and higher, the computing speed becomes faster and faster, and the main frequency of CPU (Central Processing Unit, central processing unit) becomes higher and higher. This requires higher and higher heat conduction efficiency of the heat conduction structure in the mobile phone, so as to ensure the normal and stable operation of the mobile phone and improve the user experience. [0003] The current heat conduction structure is mainly composed of a stainless steel plate and a graphite heat dissipation film, and the graphi...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/373C23C18/38
CPCC23C18/38H01L23/3735
Inventor 李明蔡程周伟杰
Owner VIVO MOBILE COMM CO LTD
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