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I/O components and electronics

A technology of input and output and electronic devices, which is applied in the field of input and output components and electronic devices, and can solve problems such as inconvenient connections

Active Publication Date: 2020-01-10
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In mobile phones, brackets are usually used to fix components (such as infrared cameras, laser projectors, receivers, etc.), but the bracket is spaced from the main board, and the components installed on the bracket are not easy to connect to the main board.

Method used

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  • I/O components and electronics
  • I/O components and electronics
  • I/O components and electronics

Examples

Experimental program
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Embodiment Construction

[0031] Embodiments of the present invention will be further described below in conjunction with the accompanying drawings. The same or similar reference numerals in the drawings represent the same or similar elements or elements having the same or similar functions throughout.

[0032] In addition, the embodiments of the present invention described below in conjunction with the accompanying drawings are exemplary, and are only used to explain the embodiments of the present invention, and should not be construed as limiting the present invention.

[0033] In the present invention, unless otherwise clearly specified and limited, the first feature may be in direct contact with the first feature or the first and second feature may be in direct contact with the second feature through an intermediary. touch. Moreover, "above", "above" and "above" the first feature on the second feature may mean that the first feature is directly above or obliquely above the second feature, or simpl...

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Abstract

The invention discloses an input and output assembly and an electronic device. The input and output assembly comprises a supporting frame, an input and output module and a circuit board, wherein the supporting frame comprises a body; the body comprises a first surface and a second surface which are opposite; the first surface is provided with an accommodating cavity; the second surface is providedwith a through hole communicated with the accommodating cavity; the input and output module is arranged in the accommodating cavity and is exposed from the through hole; the circuit board is mountedon the supporting frame and comprises a first section and a second section; the first section and the first surface are combined and are electrically connected with the input and output module; the second section comprises a combination part and a connection part which are connected; the combination part and the second surface are combined; and the connection part and the second surface are spacedand are electrically connected with an external device. Through enabling the first section and the second section of the circuit board to be electrically connected with the input and output module, the combination part of the first section and the second section is mounted on the supporting frame, the connection part of the second section is electrically connected with the external device, and the input and output module is connected onto a main board.

Description

technical field [0001] The invention relates to the technical field of consumer electronics, and more specifically, to an input and output assembly and an electronic device. Background technique [0002] In mobile phones, brackets are usually used to fix components (such as infrared cameras, laser projectors, receivers, etc.), but the brackets are spaced from the main board, and the components installed on the brackets are not easy to connect to the main board. Contents of the invention [0003] Embodiments of the present invention provide an input and output assembly and an electronic device. [0004] The input and output components of the embodiment of the present invention include: [0005] A support frame, the support frame includes a body, the body includes a first surface and a second surface opposite to each other, the first surface is provided with a receiving cavity, and the second surface is provided with a passage communicating with the receiving cavity hole; ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04M1/02
CPCH04M1/026H04M1/0264H04M1/0272H04M1/0277
Inventor 贾玉虎
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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