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Window type ball grid array packaging assembly

A ball grid array and packaging component technology, which is applied in the field of semiconductor memory components, can solve the problems affecting chip fixation, cracks, and smaller contact area, and achieves the effect of fixing the chip well and increasing the adhesive area.

Active Publication Date: 2018-10-23
CHANGXIN MEMORY TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the chip is shifted due to inaccurate positioning or other reasons, the floating area may increase, such as Figure 4 As shown, the chip 130 will produce cracks at the edge of the adhesive layer 120 due to stress concentration, and the contact area between the chip 130 and the adhesive layer 120 will also become smaller, which will affect the fixing of the chip.

Method used

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  • Window type ball grid array packaging assembly
  • Window type ball grid array packaging assembly
  • Window type ball grid array packaging assembly

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0065] Such as Figure 5 As shown, the window type ball grid array package component of this embodiment includes: a substrate 210 having opposite first surfaces 211 and second surfaces 212, and a window 213 penetrating through the first surface 211 and the second surface 212 is formed; The adhesive layer 220 is formed on the second surface 212 of the substrate 210; the chip 230 is fixed on the second surface 212 of the substrate 210 through the adhesive layer 220; the bonding wire 240 passes through the window 213 and electrically connects the chip 230 and the substrate 210 ; a plastic package 250 formed on the second surface 212 of the substrate 210 and in the window 213 to wrap the chip 230 and the bonding wire 240 ; and a solder ball 260 planted on the first surface 211 of the substrate 210 .

[0066] Such as Figure 5 and Figure 6 As shown, the adhesive layer 220 of this embodiment includes a first adhesive surface 221 and a second adhesive surface 222 located on both s...

Embodiment 2

[0071] The difference between the window type ball grid array package assembly of this embodiment and the first embodiment is the structure of the adhesive layer.

[0072] Such as Figure 8 As shown, the adhesive layer 320 of this embodiment includes a first adhesive surface 321 and a second adhesive surface 322 located on both sides of the substrate window 213, and the inner edges 323 and 324 near the window 213 each have three circular arcs. The shape of the bulge, the outer edges 325 and 326 away from the window 213 are full of arc-shaped bulges, wherein, as can be seen from the vertical mapping profile 233 of the chip 230, the first adhesive surface 321 and the second adhesive surface The edge of surface 322 beyond the bonding area of ​​chip 230 is discontinuous.

[0073] Such as Figure 9 shown, compared to Figure 8 , the vertical mapping profile 233 of the chip 230 is displaced in the negative direction of the X-axis of the substrate 210, that is, the chip 230 is dis...

Embodiment 3

[0078] The difference between the window type ball grid array package assembly of this embodiment and the first embodiment is the structure of the adhesive layer. Such as Figure 12 As shown, the adhesive layer 420 includes a first adhesive surface 421 and a second adhesive surface 422 located on both sides of the substrate window 213, the inner edges 423 and 424 near the window 213, the outer edges 425 and 426 away from the window 213, and the lateral Edges 428 and 429 are in the shape of rounded protrusions. It can be seen from the vertical mapping profile 233 of the chip 230 that the edges of the first adhesive surface 421 and the second adhesive surface 422 beyond the bonding area of ​​the chip 230 are discontinuous.

[0079] The chip 230 is displaced in the negative direction of the X-axis and the negative direction of the Y-axis before injection molding. Under the glue filling pressure generated during the injection molding process of forming the plastic package later, ...

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PUM

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Abstract

The invention provides a window type ball grid array packaging assembly comprising a substrate, an adhesive layer, a chip, a bonding wire, and a plastic packaging body. The substrate has a first surface and a second surface being opposite to the first surface; and a window penetrating the first surface and the second surface is formed on the substrate. The adhesive layer includes a first adhesivesurface and a second adhesive surface that are arranged at the two sides of the window and is formed on the second surface of the substrate. The chip is fixed to the second surface of the substrate bythe first adhesive surface and the second adhesive surface. The bonding wire penetrating the window is connected to the chip and the substrate electrically. The plastic packaging body formed on the second surface and in the window of the substrate coats the chip and the bonding wire. The plastic packaging body covers the edge of the adhesive layer; the edge of the adhesive layer includes a plurality of arc edge corners; and at least one corner of the adhesive surface of the chip is aligned at a circle area formed by one arc edge corner. Therefore, the chip crack problem is solved; the adhesive area is increased; and the chip is fixed well.

Description

[0001] This application is a divisional application of a previous application (name of invention: a window-type ball grid array package assembly; filing date: July 17, 2017; application number: 201710580774.X). technical field [0002] The present invention relates to semiconductor storage components, in particular to a window ball grid array (Window Ball Grid Array, WBGA) packaging component. Background technique [0003] Among the package types of semiconductor devices, the window type ball grid array package structure is to open a through window for the substrate carrying the chip, so that the bonding wire can pass through the window and electrically connect the substrate and the chip. [0004] Such as figure 1 As shown, a known windowed BGA package assembly 100 includes a substrate 110 having a window 113 , an adhesive layer 120 , a chip 130 , bonding wires 140 , a plastic package 150 and solder balls 160 . Substrate 110 has opposite first surface 111 and second surface...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/31
CPCH01L23/3107H01L23/3114H01L23/3128H01L2224/32225H01L2224/48091H01L2224/4824H01L2224/73215H01L2924/15311H01L2924/181H01L2924/00014H01L2924/00012H01L2924/00
Inventor 庄凌艺
Owner CHANGXIN MEMORY TECH INC