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Heat exchanger assembly and method for operating a heat exchanger assembly

A technology for heat exchangers and components, applied in heat exchange equipment, semiconductor/solid-state device components, electric solid-state devices, etc., to achieve the effect of reducing the amount of space and using efficiently

Active Publication Date: 2018-10-23
ABB (SCHWEIZ) AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Thermosiphons consume less energy than active refrigeration systems using e.g. compressors and / or pumps, but they are only capable of cooling under more limited environmental conditions

Method used

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  • Heat exchanger assembly and method for operating a heat exchanger assembly
  • Heat exchanger assembly and method for operating a heat exchanger assembly
  • Heat exchanger assembly and method for operating a heat exchanger assembly

Examples

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Embodiment Construction

[0027] In the following, various aspects and features of embodiments of the present disclosure are described. It is intended that various aspects and features may be combined with any other aspect or feature whether or not described in the context of a particular embodiment.

[0028] In the figures and the description of the embodiments, in principle identical or corresponding parts are provided with the same reference numerals. Descriptions relating to the same reference surface shall be applicable to any embodiment unless otherwise specified.

[0029] figure 1 Graph showing ambient temperature and operating power of an electronic component cooled by a prior art cooling device. In this cooling arrangement, a passive cooling circuit, such as a thermosiphon, is used.

[0030] On the horizontal axis of the graph, the operating ranges R1 , R2 and R3 are shown, while on the longitudinal axis the ambient temperature T surrounding the electronic components and the operating power...

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PUM

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Abstract

A heat exchanger assembly (1) is disclosed. The heat exchanger assembly comprises at least one passive cooling circuit (100), the passive cooling circuit comprising an evaporator (110) connectable toa device (50) to be cooled for conducting heat from the device (50) to be cooled to the cooling fluid within the evaporator (110), thereby evaporating the cooling fluid, and a condenser (120) interconnected with the evaporator (110) for receiving the evaporated cooling fluid from the evaporator (110), releasing heat from the cooling fluid to an environment of the condenser (120), thereby condensing the cooling fluid, and for returning the condensed cooling fluid to the evaporator; and an active partial circuit (200) comprising a compressor (250) and an auxiliary condenser (220), the active partial circuit (200) being activatable and deactivatable and being connected to the passive cooling circuit for receiving, in an activated state of the active partial circuit (200), the cooling fluid from the evaporator (110), for compressing the received cooling fluid by the compressor (250), for releasing heat, by the auxiliary condenser (220), from the compressed cooling fluid to an environment of the auxiliary condenser (220), and for returning the condensed cooling fluid to the evaporator (110). Furthermore, the passive cooling circuit (100) is a base-to-air type thermosiphon or an air- to-air type thermosiphon.

Description

technical field [0001] The present disclosure generally relates to heat exchanger assemblies. Certain embodiments relate to a power electronics component comprising at least one power electronics component and a heat exchanger assembly at least as disclosed herein. Additional embodiments involve the use of heat exchanger assemblies to cool electrical components. Furthermore, the present disclosure relates to methods for operating heat exchanger assemblies. Background technique [0002] In cooling applications, in particular for cooling electrical components, such as power electronic components, heat exchangers are commonly employed. A heat exchanger constitutes a cooling device for removing heat dissipated from a component to be cooled (that is, a process in which heat is transferred from position A (the component to be cooled) to position B (the destination of the removed heat)) at least partly. In particular, the destination of the removed heat involves heat discharge ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/427
CPCH01L23/427F28F27/02H05K7/20309H05K7/20318H05K7/20327H05K7/20354H05K7/20381H05K7/20936
Inventor F.阿高斯提尼D.托雷辛M.哈伯特B.阿高斯提尼
Owner ABB (SCHWEIZ) AG
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