High-performance power supply heat sink

Abstract

A high-performance power supply heat sink comprises a bottom shell and a top shell, wherein a first cooling strip is arranged at the bottom of the bottom shell, support plates are symmetrically arranged at two sides of the bottom of the bottom shell, a second cooling strip, a third cooling strip and a fourth cooling strip are sequentially arranged at two sides of the bottom shell from top to bottom, a first embedment block is arranged at the top of one side of the bottom shell, a second embedment block is arranged at the top of the other side of the bottom shell, a first embedment groove is formed in one side of an upper top part of the first embedment block, a second embedment groove is formed in an inner side wall of the second embedment block, cooling grooves are formed in two sides ofthe top plate, a first embedment strip is arranged at the bottom of one side of the top plate, a second embedment strip is arranged at the bottom of the other side of the top plate, the top plate is embedded into the first embedment groove by the first embedment plate, and the second embedment strip is embedded into the first embedment groove to achieve detachable connection with the bottom shell.The bottom shell and the top plate employ various cooling strip structures, so that that heat sink is uniform and efficient in cooling and has excellent cooling effect; and moreover, the support plates are specially arranged at two sides of the bottom of the bottom shell, and the stability is high.

Description

technical field [0001] The invention relates to a radiator, in particular to a high-performance power radiator. Background technique [0002] Most power radiators now use heat sink structure, no external power supply, natural cooling, most of them are made of aluminum alloy profiles, cut into the required size according to the size of components, at present, this kind of radiator has the following disadvantages: low tooth density , the heat dissipation area per unit volume is small, the heat dissipation effect is low, it is difficult to meet the requirements of high power and efficient heat dissipation of modern high-power electronic equipment, and because the heat sink has a simple structure, its stability is often not high. Contents of the invention [0003] In view of the above problems, the present invention proposes a high-performance power radiator. [0004] The specific technical scheme is as follows: [0005] A high-performance power radiator, characterized in th...

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Problems solved by technology

[0002] Most power radiators now use heat sink structure, no external power supply, natural cooling, most of them are made of aluminum alloy profiles, cut into the required size according to the size of components, at present, this kind of radiator has the following disadvantages: low tooth density , the heat dissipation area per unit volume is small, the heat dissipation effect is low, it is difficult to meet the requirements of high power and efficient heat dissipation of modern high-power electronic equipment, and because of the simple structure of the heat sink, the stability is often not high

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