PCB having multi-step ladder grooves

A technology of stepped grooves and groove bottoms, which is applied to printed circuits connected with non-printed electrical components, details of conductive pattern layout, printed circuit components, etc. Problems such as board assembly volume, etc., achieve the effect of saving installation space, reducing assembly volume, and ensuring the overall structural strength

Inactive Publication Date: 2018-11-16
DONGGUAN SHENGYI ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the grooves of the current printed circuit board are metallized or non-metallized single grooves
This kind of groove design with a single size can only be used to assemble a single regular-shaped component, and cannot realize the mounting of components with special-shaped structures or the selective mounting requirements of components. For additional small chips or power amplifiers Components that need to be assembled need to be mounted on the surface of the printed circuit board, thereby increasing the assembly volume of the printed circuit board

Method used

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  • PCB having multi-step ladder grooves

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Embodiment Construction

[0028] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention. In addition, it should be noted that, for the convenience of description, only the parts related to the present invention are shown in the drawings but not all of them.

[0029] like figure 1 As shown, this embodiment provides a PCB 1 with multi-level stepped grooves, one side of the PCB 1 is provided with a first groove 2, and the groove bottom and the groove wall of the first groove 2 are metallized; The groove bottom of the first groove 2 is provided with a second groove 3, and the groove bottom and the groove wall of the second groove 3 are metallized; the groove bottom of the second groove 3 is provided with a through groove 4, The groove w...

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Abstract

The invention relates to the technical field of circuit board production, and discloses a PCB having multi-step ladder grooves. One side of the PCB is provided with a first groove, and the groove bottom and the groove wall of the first groove are metallized; a second groove is formed in the groove bottom of the first groove, and the groove bottom and the groove wall of the second groove are metallized; a through slot is formed in the groove bottom of the second groove, and the groove wall of the through slot is not metallized. The PCB with the multi-step ladder grooves according to the presentinvention can realize the mounting of the special-shaped components or the selective mounting of the components, fully utilize the space of the ladder grooves, and reduce the installation volume of the PCB.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a PCB with multi-level stepped grooves. Background technique [0002] Printed circuit board (PCB for short) is the provider of electrical connection for electronic components. Before the appearance of printed circuit boards, the interconnection between electronic components relied on direct connection of wires to form a complete circuit. In contemporary times, circuit panels only exist as effective experimental tools, and printed circuit boards have occupied an absolute dominant position in the electronics industry. [0003] In order to reduce the assembly volume of the printed circuit board, or to assemble components that need to be sunken, step grooves are usually provided on the printed circuit board in existing designs. However, the grooves of the current printed circuit board are all metallized or non-metallized single grooves. This kind of groove design ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/18H05K1/02
CPCH05K1/183H05K1/0203H05K1/0298
Inventor 纪成光王洪府赵刚俊焦其正
Owner DONGGUAN SHENGYI ELECTRONICS
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