An integrated photoelectric receiving module containing a low noise amplifier and a production process thereof

A low-noise amplifier and photoelectric receiving technology, which is applied in the coupling of optical waveguides and other directions, can solve the problems that discrete form optical receiving modules are difficult to meet the requirements, achieve short distance, high process efficiency, and reduce the effect of parasitic inductance

Inactive Publication Date: 2018-11-23
重庆霓扬科技有限责任公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It is difficult to meet the requirements based on discrete optical receiving modules

Method used

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  • An integrated photoelectric receiving module containing a low noise amplifier and a production process thereof
  • An integrated photoelectric receiving module containing a low noise amplifier and a production process thereof
  • An integrated photoelectric receiving module containing a low noise amplifier and a production process thereof

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Embodiment Construction

[0028] The present invention will be further described below with the embodiment of the 40 GHz integrated photoelectric receiving module containing a low-noise amplifier in conjunction with the accompanying drawings.

[0029] Such as Figure 1 to Figure 5 As shown, an integrated photoelectric receiving module containing a low noise amplifier is characterized in that it includes an integrated packaging shell 1, a ceramic substrate 2, a power substrate 3, a radio frequency connector 4, an optical fiber 5, a power insulator 6 and a radio frequency insulator 7 A high-speed photodiode 21 and a low-noise amplifier 22 are mixed and integrated on the ceramic substrate 2, the ceramic substrate 2 is electrically connected to the power substrate 3, and the power insulator 6 is connected to the power substrate 3, so The optical fiber 5 is photoelectrically coupled to the high-speed photodiode 21 , the radio frequency connector 4 is fixedly connected to the integrated packaging shell 1 , a...

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Abstract

The invention provides an integrated photoelectric receiving module containing a low noise amplifier and a production process thereof. The module adopts the design of a hybrid integration structure ofa high-speed photodiode die and a low noise amplifier chip; compared with a split structure, the structure has the advantages that the size is reduced, the radio frequency performance is improved andthe reliability is improved. The hybrid integration process is a common-substrate micro-assembly process and the high-speed photodiode die, the low noise amplifier chip and micro-strip lines are aligned, bonded and baked at a time through an epoxy silver glue process, and the process is simple, the process time is reduced and the process efficiency is high; a hybrid integration circuit substrateis made of AlN substrate material with good surface finish and high thermal conductivity; the hybrid integration circuit substrate adopts a thin film circuit process and a gold wire wedge welding process is utilized for welding, so that the influence of parasitic inductance is effectively reduced and the requirement of high-speed module packaging is better satisfied; the whole packaging structureis simple and practical in design, is high in process production feasibility and is suitable for batch production.

Description

technical field [0001] The invention belongs to the technical field of semiconductors, and relates to the design and production process of an integrated photoelectric receiving module containing a low-noise amplifier. Background technique [0002] With the continuous development of microwave photonics technology, radar and electronic warfare systems based on microwave photonic link architecture have been developed rapidly and widely used. The broadband analog optical receiving module is used for the reception and detection of broadband analog optical signals in radar and electronic warfare systems, and is one of the core components of the microwave photonic link. [0003] With the development of a new generation of long-range multi-target tracking high-sensitivity and high-resolution radar electronic warfare equipment, there are more and more antenna arrays in the phased array system, and the scale of antenna elements is getting larger and larger. The microwave photonic chai...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B6/42
Inventor 肖楠刘浪段淳淳刘均周淼
Owner 重庆霓扬科技有限责任公司
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