Electronic package and method for fabricating same

Abstract

An electronic package and a method for fabricating the same are provided. An antenna substrate is stacked on a carrier structure stacking assembly. Since no additional layout area is required to be added to the carrier structure stacking assembly, the length of an antenna can be designed as required, and the antenna can thus meet its operational requirement.

Description

technical field [0001] The invention relates to an electronic package, especially an electronic package with an antenna structure. Background technique [0002] With the vigorous development of the electronic industry, electronic products are gradually moving towards the trend of multi-function and high performance. At present, wireless communication technology has been widely used in various consumer electronic products to receive or send various wireless signals. In order to meet the appearance design requirements of consumer electronic products, the manufacture and design of wireless communication modules are developed towards light, thin, short, and small requirements. Among them, the planar antenna (Patch Antenna) is small in size, light in weight, and easy to manufacture. characteristics and are widely used in wireless communication modules of electronic products such as cell phones and personal digital assistants (PDA). [0003] figure 1 It is a three-dimensional s...

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Problems solved by technology

[0004] However, it is known that in the wireless communication module 1, the antenna structure 12 is planar, so based on the electromagnetic radiation characteristics between the antenna structure 12 and the electronic component 11 and the volume limitation of the antenna structure 12, in the manufacturing process, the The antenna body 120 is difficult to be integrated with the electronic component 11, that is, the packaging material 13 only covers the electronic component 11, but does not cover the antenna body 120, so that the mold for the packaging process needs to correspond to the layout area of ​​these electronic components 11, and Does not correspond to the size of the substrate 10, which is not conducive to the packaging process

[0005] Furthermore, because the antenna structure 12 is planar, when the length of the antenna structure 12 needs to be increased, it is necessary to increase the layout area (the area where the packaging material 13 is not formed) on the surface of the substrate 10 to form the antenna body 120. , but the length and width of the substrate 10 are fixed, so it is difficult to increase the area of ​​the layout area, so that the length of the antenna structure 12 cannot be increased, and thus the requirements for antenna operation cannot be met.

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