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A pcb with multi-level stepped grooves

A technology of stepped grooves and groove bottoms, which is applied in the directions of printed circuit parts, printed circuits, electrical components, etc. PCB assembly volume and other issues

Active Publication Date: 2020-11-13
DONGGUAN SHENGYI ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] 1) The shape of the first-order stepped groove is single, which can only be used to assemble a single component, and cannot realize the placement of components with special-shaped structures;
[0005] 2) A single metallized step groove or a single non-metallized step groove cannot meet the special assembly requirements of components at the same time, or integrate other more power amplifier devices. For additional small chips or power amplifiers that need to be equipped Components need to be mounted on the surface of the printed circuit board, which increases the assembly volume of the printed circuit board

Method used

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  • A pcb with multi-level stepped grooves
  • A pcb with multi-level stepped grooves

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] The schematic diagram of the PCB structure with multi-level stepped grooves in Embodiment 1 of the present invention is as follows figure 1 shown. The PCB is composed of multiple core boards 4 , and prepregs 5 are stacked between adjacent core boards 4 .

[0027] One side of the PCB is provided with a first groove 1, the groove bottom and the groove wall of the first groove 1 are non-metallized, and the number of the first groove 1 can be one or more; between multiple first grooves 1 , the distance between two adjacent first grooves 1 is 3-7mm. The groove bottom of the first groove 1 is provided with a second groove 2, the groove wall and groove bottom of the second groove 2 are metallized, and the number of the second groove 2 can be one or more; multiple second grooves 2, the side distance between two adjacent second grooves 2 is 4-6 mm, and the horizontal cross-sectional area of ​​the first groove 1 is larger than the horizontal cross-sectional area of ​​the second...

Embodiment 2

[0034] The schematic diagram of the PCB structure with multi-level stepped grooves described in Embodiment 2 of the present invention is as follows figure 2 As shown, the structure is the same as that in Embodiment 1, which will not be repeated here.

[0035] The difference in structure is that the metallized groove wall of the second groove 2 in embodiment 2 is not connected to the inner layer circuit patterns on both sides, that is, the inner metal layer of the core board with the second groove 2 has a ring-shaped first groove. Two notches, the second notch is opened on the outer periphery of the second stepped groove, and the horizontal cross-sectional profile of the second notch is located at the periphery of the horizontal cross-sectional profile of the second stepped groove. The groove wall structure of the second groove 2 is stronger due to the metallization of the groove wall, which improves the structural strength of the PCB. At the same time, the setting of the sec...

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Abstract

The invention relates to the technical field of circuit board production, and discloses a PCB with a multistep groove. One side of the PCB is provided with a first groove, and the groove bottom and the groove walls of the first groove are non-metalized, a second groove is opened on the groove bottom of the first groove, the groove walls and the groove bottom are metalized, and a though groove is opened on the groove bottom of the second groove. According to the PCB with a multistep groove, the space of the step groove on the PCB can be fully utilized, the step groove contains both the metalized groove walls and the non-metalized groove walls, can realize the mounting of the special-shaped components and components with various of different size, meet the mounting requirement that compositemultiple functional and is convenient to perform further miniaturization on the PCB, and suitable for mounting the components with special-shaped structures or special combined components.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a PCB with multi-level stepped grooves. Background technique [0002] Printed circuit board (PCB for short) is the provider of electrical connection for electronic components. Before the appearance of printed circuit boards, the interconnection between electronic components relied on the direct connection of wires to form a complete circuit. In contemporary times, circuit panels only exist as effective experimental tools, and printed circuit boards have occupied an absolute dominant position in the electronics industry. [0003] In order to meet the high-density mounting or crimping requirements of printed circuit boards, stepped grooves are designed on multilayer printed circuit boards to reduce the assembly volume. The current stepped groove design is mostly a first-order metallized or non-metallized stepped groove, which is used in microwave radio frequency ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02
CPCH05K1/0298H05K2201/09845
Inventor 纪成光王洪府白永兰袁继旺陈正清
Owner DONGGUAN SHENGYI ELECTRONICS