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Method of semiconductor device fabrication

A manufacturing method and semiconductor technology, which can be used in the manufacture of semiconductor/solid-state devices, devices for coating liquids on surfaces, and photosensitive materials for opto-mechanical equipment, etc. And other issues

Inactive Publication Date: 2018-12-07
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In forming the above materials, defects, irregularities, and contamination on the surface can disrupt processing and can greatly affect yield and device performance
Existing technology is still not perfect for all aspects

Method used

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  • Method of semiconductor device fabrication
  • Method of semiconductor device fabrication
  • Method of semiconductor device fabrication

Examples

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Embodiment Construction

[0031] The different embodiments or examples provided in the following content can implement different structures of the present disclosure. The embodiments of specific components and arrangements are used to simplify the disclosure rather than limit the disclosure. For example, the description of forming the first member on the second member includes direct contact between the two, or there are other additional members between them instead of direct contact. In addition, in the various examples disclosed in the present disclosure, reference numbers may be repeated, but these repetitions are only used for simplification and clear description, and do not mean that units with the same reference number between different embodiments and / or arrangements have the same corresponding relationship.

[0032] In addition, spatially relative terms such as "below", "below", "lower", "above", "above", or similar terms can be used to simplify the description of an element and another element in...

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Abstract

Provided is a material composition and method for that includes providing a primer material including a surface interaction enhancement component, and a cross-linkable component. A cross-linking process is performed on the deposited primer material. The cross-linkable component self-cross-links in response to the cross-linking process to form a cross-linked primer material. The cross-lined primermaterial can protect an underlying layer while performing at least one process on the cross-linked primer material.

Description

Technical field [0001] The embodiment of the present invention relates to a method of manufacturing a semiconductor, and more particularly to a material composition used to prepare a target surface of a substrate for subsequent processing. Background technique [0002] The electronic industry has an increasing demand for smaller and faster electronic devices, and electronic devices provide a large number of complex functions at the same time. In summary, the continuing trend in the semiconductor industry is to produce low-cost, high-performance, and low-energy integrated circuits. These remote targets can be achieved by reducing the size of semiconductor integrated circuits (such as the smallest structure size), thereby improving productivity and reducing related costs. However, shrinking the size will also increase the complexity of the integrated circuit manufacturing process. In order to achieve continuous progress in semiconductor integrated circuits and device units, simil...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/02
CPCH01L21/02664H01L21/02118H01L21/02282H01L21/0271H01L21/31133C09D4/00G03F7/11H01L21/0332H01L21/0274H01L21/02345H01L21/3105H01L21/02318B05D3/108C09D133/10C08L33/10C09D133/12B05D3/06C09D133/08C08L33/12C09D135/02H01L21/3081H01L21/3086
Inventor 赖韦翰张庆裕林进祥
Owner TAIWAN SEMICON MFG CO LTD