Numerically controlled low-intensity focused ultrasonic excitation and imaging system
A technology for focusing ultrasound and imaging systems, which is applied in the directions of ultrasound/sonic/infrasonic Permian technology, ultrasound/sonic/infrasonic image/data processing, ultrasound/sonic/infrasonic diagnosis, etc., which can solve the positioning range and position inaccuracy and other problems, to achieve the effect of increasing positioning accuracy, increasing precision, and fast adjustment speed
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Embodiment 1
[0075] Such as figure 1 As shown: CNC low-intensity focus ultrasonic excitation and imaging system, including: detection probes and control modules;
[0076] The detection probe includes a probe guard housing 4, and a bracket 3 is mounted in the probe guard 4, a bracket shaped focus array transmitter 2 is mounted on the bracket 3. The focus array transmitter 2 is located in the center position of the focus, and the hole is placed. The imaging probe is provided, and the imaging probe is also referred to as an imaging transducer 1, and the imaging transducer 1 is used to convert the input electrical power to a frequency of 1-5 MHz ultrasonic waves, and the imaging transducer 1 is also used to receive ultrasonic information and receive according to receipt. Ultrasonic signal display microbubble targets before and the ultrasound image after the blasting. The number of arrays transmitted by the focus array transmitter 2 is 128-256.
[0077] The control module, the control module, and ...
Embodiment 2
[0130] The difference between the second embodiment and the embodiment is, if Figure 49 with 50 As shown in the second embodiment, an anti-iron heat dissipation device is also provided, and the anti-iron heat dissipation device is disposed on the side wall of the probe protective case 4, and the anti-iron heat dissipation device includes: a thermally conductive plate 6 disposed on the side wall of the probe guard 4, a probe A heat dissipation plate 5 is provided on the outer wall of the protective case 4, the heat dissipation plate 5 and the heat conductance plate 6 hinge, the heat dissipation plate 5 and the heat conductance plate 6 are arranged to bring the heat sink 5 and the probe protective case 4 torsion spring, heat dissipation Both the plate 5 and the heat conductance plate 6 use a metal material having a good thermal conductivity. A solution chamber 7 is provided between the heat sink 5 and the heat conductance plate 6, and the solution chamber 7 is slidably connected to...
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