Zero-emission apparatus and process for environmentally recovering acidic copper etching waste fluid

A zero-discharge and copper-etching technology, applied in the field of environmental protection recovery devices for acid copper-etching waste liquid, can solve the problems of not meeting the environmental protection requirements of completely zero-waste wastewater discharge, and achieve a small footprint, low equipment cost, and significant economic benefits. Effect

Pending Publication Date: 2018-12-21
惠州大亚湾亿田环保技术有限公司
View PDF13 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the existing treatment methods have their limitations, and have not met the environmental protection requirements of completely zero waste wastewater discharge.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Zero-emission apparatus and process for environmentally recovering acidic copper etching waste fluid
  • Zero-emission apparatus and process for environmentally recovering acidic copper etching waste fluid

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses. It should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner" and "outer" are Based on the orientation or positional relationship shown in the drawings, it is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orienta...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a zero-emission apparatus for environmentally recovering an acidic copper etching waste fluid, comprising an etching machine used for online etching, a precipitation tank, a pneumatic filter press and a blending tank. The precipitation tank is separately connected with the etching machine and the pneumatic filter press, the pneumatic filter press is connected with the blending tank, and the blending tank is connected with the etching machine. A copper etching waste fluid pump is arranged between the etching machine and the precipitation tank, a pneumatic pump is arranged between the precipitation tank and the pneumatic filter press. A clear liquid pump is arranged between the pneumatic filter press and the blending tank, and a new etching liquid pump is arranged between the blending tank and the etching machine. The invention further discloses a process for environmentally recovering the acidic copper etching waste fluid. Copper ions in the acidic waste liquid are precipitated by adopting a chemical precipitation method, and a chloride ion concentration and a pH value in the solution is adjusted to remake the solution to an ammonium chloride etching liquid raw material. New wastewater or waste is not generated in the whole process, wastewater is treated from a source. The apparatus and the process is environmental and clean, short in the operation process, low in the equipment cost, small in the occupied area, and remarkable in the economic benefit.

Description

technical field [0001] The invention relates to the technical field of recycling copper-etching waste liquid, in particular to a zero-emission environmentally friendly recovery device and process for acidic copper-etching waste liquid. Background technique [0002] The acidic etching solution is composed of ammonium chloride and hydrochloric acid. When the etching machine is finished, the waste liquid is discharged. The composition of the waste liquid mainly contains 8% copper ions, 10% ammonia nitrogen ions, and 24% chloride ions. Such ingredients are generally collected uniformly by the environmental protection department and handled professionally. If it goes directly into rivers and lakes without treatment, it will damage the environment, destroy the ecological balance, and endanger human survival. Some manufacturers use the waste liquid to produce copper sulfate, but after the production of copper sulfate, the wastewater will increase sulfuric acid in addition to ammon...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/46C22B7/00C22B15/00
CPCC22B7/006C22B15/0089C23F1/46Y02P10/20
Inventor 徐浩田
Owner 惠州大亚湾亿田环保技术有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap