A LED chip package and an LED display

A technology of LED chips and diodes, applied in the direction of electric solid-state devices, semiconductor devices, electrical components, etc., can solve the problems of limited display effect, limited pixel minimum pitch, and many packaging pins, so as to improve resolution and display effect , reduce the average number of pins, reduce the effect of pixel pitch

Inactive Publication Date: 2018-12-21
XIAMEN XM PLUS TECH LTD
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, since a single pixel of the LED chip package in the prior art has four pins, the average number of pins in the horizontal or vertical direction of the pixel is two, so that the minimum pixel pitch is limited, resulting in that the resolution of the LED display cannot be improved. , so that its display effect is limited
On the other hand, due to the large number of packaging pins for a single pixel, the packaging cost is relatively large

Method used

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  • A LED chip package and an LED display
  • A LED chip package and an LED display
  • A LED chip package and an LED display

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Embodiment Construction

[0032] The embodiment of the present invention provides an LED chip package and an LED display, which reduces the pixel pitch during use, which is beneficial to improving the resolution and display effect of the LED display, and the reduction in the number of pins is beneficial to reducing the packaging cost.

[0033] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0034] Please refer to Figure...

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Abstract

The invention discloses an LED chip package and an LED display. The LED chip package comprises M*N pixel units, each pixel unit forms an M*N array, each pixel unit comprises three laterally distributed diodes, three diodes include a red diode, a green diode and a blue diode. Wherein the first terminal of each diode of the ith row is connected to the ith first common package pin; The second terminal of each diode in the j-th column is connected with the j-th common package pin; M and N are integers of not less than 2, i belongs to [1, M], j belongs to [1, 3N]. The present application reduces the average number of pins per pixel, thereby reducing the pixel spacing, facilitating improved resolution and display effect of an LED display, and reducing the number of pins is conducive to reducingpackage cost.

Description

technical field [0001] The embodiments of the present invention relate to the technical field of LED chip packaging, in particular to an LED chip packaging and an LED display. Background technique [0002] The LED display is composed of LED chip packaging, and the LED chip packaging in the prior art is made of single-pixel packaging, wherein the single-pixel packaging is to integrate three RGB (red, green, blue) LED chips into four packages. pin package, specific as Figure 1-Figure 4 As shown, among them, such as figure 1 and figure 2 They are the single-pixel common anode LED chip circuit diagram and package pin diagram respectively, image 3 and Figure 4 They are the circuit diagram of the single-pixel common-cathode LED chip and the package pin diagram respectively. [0003] Generally, the minimum pixel pitch that constitutes an LED display is related to the soldering pitch of the package pins, and the fewer the average pins of a pixel in the horizontal and vertic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/075H01L33/54H01L33/62
CPCH01L25/0753H01L33/54H01L33/62
Inventor 林政弘
Owner XIAMEN XM PLUS TECH LTD
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