This invention discloses a vertically stacked uLED pixel structure, a monolithically integrated full-color uLED microdisplay
chip suitable for flip-
chip packaging, and its fabrication method. By vertically stacking blue, green, and
red light-emitting units, full-color display is achieved through monolithic integration. The blue, green, and
red light-emitting units share the same light-emitting surface, reducing the planar area occupied by the pixel units and improving
display resolution. Simultaneously, shallow trenches filled with insulating
dielectric are used to isolate adjacent pixel structures, further reducing pixel spacing and increasing
pixel density. By placing the insulating
dielectric layer on the surface of the
red light-emitting unit,
metal interconnect rewiring is implemented within the insulating
dielectric layer, and the interconnects are led out from the insulating
dielectric layer through lead-out structures electrically connected to the
metal interconnects. This avoids the use of through-
silicon vias (TSVs), simplifying the fabrication process, streamlining the pixel wiring structure, and optimizing the circuit
layout.