Flexible substrate chip-on flex repair

Abstract

A digital radiographic detector includes redundant bonding pads formed on the array substrate and electrically connected to the array of photosensors. A plurality of COFs are each electrically connected to one of the bonding pads. A repair may be performed by removing a bond pad and reconnecting a corresponding COF to a redundant bond pad. A PCB including array read out electronics is electricallyconnected to the plurality of COFs.

Description

technical field [0001] The subject matter disclosed herein relates to digital radiography detector panels. Specifically related to the fabrication of flexible substrate DR detectors. Background technique [0002] When an x-ray detector is assembled with a flexible substrate sensor array, it may be more difficult to replace chip-on-film (COF) electrical connections to the readout circuitry than for glass-based sensor arrays. The process of removing a COF from a flexible substrate sensor array in a manner that allows rejoining of the COF can be problematic. Flexible substrate sensor array COF pads and connection traces can be damaged through mechanical and chemical removal and cleaning processes. When this occurs, it can render the flexible substrate sensor array x-ray detector unusable. [0003] On glass-based sensor arrays, the gate driver and readout IC COF is an anisotropic conductive film (ACF), which is bonded to the array connection pads in the area adjacent to the i...

AI Technical Summary

Problems solved by technology

In the case of flexible polyimide-based sensor arrays, it may not be easy to replace one of the COFs

ACF connections to polyimide may need to be reworked as pad bonds to polyimide are more brittle than pad bonds used on glass substrates and thus may be broken unintentionally

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