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Socket based on chip testing

A chip and socket technology, applied in the field of sockets based on chip testing, can solve problems such as power supply impedance increase and power supply performance degradation, and achieve the effects of reducing power supply ripple, reducing impedance parameters, and reducing inductance

Pending Publication Date: 2019-01-01
上海泽丰半导体科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With a large inductance, the impact on the integrity of the power supply is very large, the impedance of the power supply will be significantly increased, and the performance of the power supply will be significantly reduced

Method used

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  • Socket based on chip testing
  • Socket based on chip testing
  • Socket based on chip testing

Examples

Experimental program
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Embodiment Construction

[0025] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the specific implementation manners of the present invention will be described below with reference to the accompanying drawings. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention, and those skilled in the art can obtain other accompanying drawings based on these drawings and obtain other implementations.

[0026] In order to make the drawing concise, the parts related to the present invention are only schematically shown in each drawing, and they do not represent the actual structure of the product.

[0027] The present invention provides a socket for testing a chip, comprising: a cover 1 and a base 3; the side of the base 3 facing the cover 1 is provided with a station for accommodating the chip to be tested; The side of the base 3 facing away from the cover 1 is provided with a co...

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Abstract

The invention discloses a socket for chip testing. The socket comprises a cover body and a pedestal. A station for accommodating a to-be-tested chip is arranged at one side, facing the cover body, ofthe pedestal; and a connector assembly is arranged at one side, with back to the cover body, of the pedestal. In addition, the socket also includes a printed circuit board arranged below the station.The connector assembly is connected electrically with a pin of the to-be-tested chip through the printed circuit board; and a capacitor is arranged on the printed circuit board. According to the application, the printed circuit board with the capacitor welded is arranged at the pedestal of the socket; and because of adding of the capacitor, the inductance value of the connector assembly is changed, so that the power source performance is provided.

Description

technical field [0001] The invention relates to the field of chip testing, in particular to a socket based on chip testing. Background technique [0002] In the chip production process, it is necessary to use testing methods to ensure that the functions of the chip meet the design requirements. The chip test can be divided into two types of tests, the first type is the test before wafer packaging, and the second type is the test after wafer packaging. Among them, the first type of test needs to use a probe card (probe) for testing, and the second type of test needs to use a loadboard (loadboard). During carrier board testing, in order to facilitate screening, a socket (socket) is usually added on the carrier board to store chips to be tested. One end of the Socket pin is in contact with the PCB, and the other end is in contact with the chip pins. [0003] Since the current chips are mainly packaged in BGA, the socket pins are also arranged in a BGA-like array. As the chip...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R1/04G01R31/28
CPCG01R1/04G01R31/2851
Inventor 梁建罗雄科
Owner 上海泽丰半导体科技有限公司
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