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Radiation Emitting Components

A technology for radiation emission, components, applied in the direction of optical components, electrical components, electro-solid devices, etc., can solve problems such as undesired, unsuitable high current methods, etc.

Active Publication Date: 2021-10-15
OSRAM OPTO SEMICON GMBH & CO OHG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Depending on boundary conditions, high current methods may be inappropriate or undesirable

Method used

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  • Radiation Emitting Components
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Examples

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Embodiment Construction

[0066]A possible configuration of a photovoltaic radiation emitting assembly is described with reference to the following schematic diagram. These components comprise a radiation source comprising one or more radiation-generating semiconductor layer sequences 120, 220 arranged next to each other, conversion elements 140, 240 for radiation conversion and optical waveguide devices 130, 230, 231, 232. The optical waveguide device 130 , 230 , 231 , 232 may also be referred to as an optical waveguide cavity, which is optically connected to the radiation source and conversion element 140 , 240 . Sides or surface areas of the optical waveguide device 130, 230, 231, 232 that are not used for optical coupling are configured in a reflective manner. Via the emission surface 125 , 225 optical radiation can be emitted from the radiation source and coupled into the optical waveguide device 130 , 230 , 231 , 232 . Via the input surface 141 , 241 optical radiation from the optical waveguide...

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Abstract

The invention relates to a radiation emitting assembly (101, 201). The assembly has a radiation source with at least one semiconductor layer sequence (120, 220) for generating radiation; a fiber optic component (130, 230) arranged downstream of the radiation source and a fiber optic component arranged downstream of the radiation source Conversion elements (140, 240) for converting radiation. Radiation from the radiation source can be emitted via the emission region ( 125 , 225 ) and injected into the fiber optic component ( 130 , 230 ). Radiation from the fiber optic component ( 130 , 230 ) can be fed into the conversion element ( 140 , 240 ) via the input region ( 141 , 241 ). The emission area (125, 225) of the radiation source is larger than the input area (141, 241) of the conversion element (140, 240).

Description

technical field [0001] The present invention relates to radiation emitting assemblies. The component comprises at least one semiconductor layer sequence for generating radiation and a conversion element for radiation conversion. [0002] This patent application claims priority from German patent application 10 2016 109 308.4, the disclosure content of which is hereby incorporated by reference. Background technique [0003] The radiation-emitting component can comprise a semiconductor chip comprising a semiconductor layer sequence for generating radiation and a conversion element arranged on the semiconductor chip. The radiation generated by the semiconductor layer sequence of the semiconductor chip can be converted at least partially by means of the conversion element. After passing through the conversion element, radiation which may comprise converted and unconverted radiation fractions may be emitted from the conversion element. [0004] Depending on the application of ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/50H01L33/46H01L33/60H01L25/075H01L27/15H01L33/62H01L33/64G02B6/00
CPCH01L25/0753H01L27/153H01L27/156H01L33/46H01L33/505H01L33/507H01L33/54H01L33/60H01L33/644H01L2924/181H01L2224/48091H01L33/62H01L2924/00014H01L2924/00012G02B6/4214H01L33/56
Inventor S.格勒奇
Owner OSRAM OPTO SEMICON GMBH & CO OHG