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Method of plating non-uniform multi-layer thin film

A multi-layer thin film, non-uniform technology, applied in the direction of coating, sputtering plating, ion implantation plating, etc., can solve problems such as inability to plate multi-layer thin films and limit research work

Active Publication Date: 2019-01-15
NINGBO UNIVERSITY OF TECHNOLOGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] Using the coating method in the prior art, it is impossible to plate a multilayer film with uneven thickness from the middle of the sample to the edge of the sample in the cross-sectional direction, that is, the thickness of the film layer from the middle of the sample surface to the sample surface At the edge, the thickness of the film layer gradually becomes smaller or larger, thus limiting the research work of researchers on multilayer films with non-uniform thickness from the middle of the sample to the edge of the sample in the cross-sectional direction

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  • Method of plating non-uniform multi-layer thin film
  • Method of plating non-uniform multi-layer thin film

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Embodiment Construction

[0027] The invention will be described in further detail below in conjunction with the accompanying drawings and specific embodiments.

[0028] The inventive concepts of the present disclosure are described below using terms commonly used by those skilled in the art to convey the substance of their work to others skilled in the art. These inventive concepts may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of inclusion to those skilled in the art. It should also be noted that these embodiments are not mutually exclusive. Components, steps or elements from one embodiment may be assumed to be present or used in another embodiment. Various alternative and / or equivalent implementations may be substituted for the specific embodiments shown and described without departing from the s...

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Abstract

The invention relates to the technical field of film-plating equipment, and particularly relates to a method of plating a non-uniform multi-layer thin film. The method includes: S1) cleaning a test piece (3) with acetone; S2) drying the test piece (3); S3) placing the test piece (3) on a test piece table (3); S4) plating a first thin film layer (301), wherein the aperture of a diaphragm (5) is driven to be increased from zero at the rate of V1 by means of a project control system; S5) plating a second thin film layer (302), wherein a shield device (6) is driven to be increased from minimum radius status at the rate of V2 by means of the project control system; S6) plating a third thin film layer (303), wherein the aperture of the diaphragm (5) is driven to be increased from zero at the rate of V3 by means of the project control system; S7) completing the film plating operation and turning the film-plating equipment of the non-uniform multi-layer thin film off. By means of the method, the non-uniform multi-layer thin film can be formed, which lays the foundation of researching on the non-uniform multi-layer thin film.

Description

technical field [0001] The invention relates to the technical field of coating, in particular to a method for coating a non-uniform multi-layer film. Background technique [0002] The application of magnetron sputtering technology is becoming more and more extensive, and it plays a huge role in the fields of industrial production and scientific research. [0003] The magnetron sputtering coating system is developed from the basic two-pole sputtering system to solve the problems that the two-pole sputtering coating speed is much slower than evaporation, the plasma ionization rate is low, and the thermal effect of the substrate is obvious. The magnetron sputtering system places a 100-1000 Gauss powerful magnet behind the cathode target, and the vacuum chamber is filled with an inert gas (Ar) at a pressure of 0.1-10 Pa as a carrier for gas discharge. Under the action of high pressure, Ar atoms ionize into Ar + Ions and electrons generate a plasma glow discharge. During the pr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/35C23C14/04
CPCC23C14/044C23C14/352
Inventor 鲍明东
Owner NINGBO UNIVERSITY OF TECHNOLOGY
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