Substrate holder

Abstract

The invention discloses a substrate holder. The substrate holder comprises a substrate carrying disc and a temperature sensor for measuring the temperature of a substrate. The substrate holder furthercomprises a fluid input tube, a fluid output tube and a temperature control device. The substrate carrying disc is provided with a heat conducting chamber. One end of the fluid input tube is connected with the output port of the temperature control device, and the other end of the fluid input tube is in communication with the heat conducting chamber. One end of the fluid output tube is in communication with the heat conducting chamber, and the other end of the fluid output tube is connected with the return port of the temperature control device. The substrate holder of the invention has the advantages of simplified structure, high temperature control precision, continuous adjustability of temperature, etc.

Description

technical field [0001] The invention relates to vacuum coating equipment, in particular to a substrate table. Background technique [0002] In the field of vacuum coating equipment, the uniformity and adhesion of the film on the surface of the substrate are the key indicators to measure the quality of the film and the performance of the coating equipment. The quality of the film is determined by many factors. For example, for the magnetron sputtering coating equipment, the distribution uniformity of the electromagnetic field, the rationality of the gas distribution, the distance between the target and the substrate, the movement mode of the substrate, and the uniformity of heating of the substrate will all affect the formation. film quality. As far as the substrate is concerned, it mainly includes two aspects: the movement mode of the substrate and the temperature control of the substrate. [0003] During the growth process of the film, the temperature of the substrate is ...

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Problems solved by technology

However, the latter two motion structures are obviously more complicated, and the volume becomes larger, resulting in a larger volume of the coating chamber and a considerable increase in equipment costs.

[0006] In addition, the loading capacity of the substrate table is limited. After the process is completed in sequence, the process chamber needs to be opened to load and unload the film, and then the vacuum is established again to complete the process. In this cycle, a lot of time is wasted on establishing the vacuum, which will seriously affect production. schedule, but also increased production costs

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