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A kind of igbt power module with electromagnetic isolation function

A technology of electromagnetic isolation and power modules, which is applied in the direction of circuits, electrical components, and electrical solid devices, can solve problems affecting the performance of IGBT power modules, etc., and achieve the effects of achieving conductive continuity, improving electromagnetic shielding functions, and improving performance

Active Publication Date: 2021-03-23
浙江芯丰科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At the same time, the electromagnetic field generated by the electronic devices near the IGBT power module will also affect the internal working performance of the IGBT power module

Method used

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  • A kind of igbt power module with electromagnetic isolation function
  • A kind of igbt power module with electromagnetic isolation function
  • A kind of igbt power module with electromagnetic isolation function

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Embodiment Construction

[0027] In order to make the object, technical solution and advantages of the present invention clearer, the embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0028] see Figure 1 to Figure 4 As shown, a kind of IGBT power module with electromagnetic isolation function of the present invention comprises end cap 10, plastic casing 20, components and parts, bonding wire 40 and metal base plate 50; In the housing composed of the tube case 20 and the metal base plate 50, a power semiconductor chip 30 is included; the power semiconductor chip 30 is connected to the bonding wire 40; the IGBT power module also includes an electromagnetic isolation unit; the electromagnetic isolation unit It includes a metal shell 60 arranged in the housing; the metal shell 60 is set above the components and can cover the components; the metal shell 60 is also connected to the metal bottom plate 50 .

[0029] Specifically, t...

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Abstract

The invention discloses an IGBT power module with an electromagnetic isolation function. The IGBT power module comprises an end cover, a plastic pipe shell, a component, a bonding line and a metal bottom plate, wherein the component is arranged in a shell comprising the end cover, the plastic pipe shell and the metal bottom plate and comprises a power semiconductor chip, the power semiconductor chip is connected with the bonding line, the IGBT power module also comprises an electromagnetic isolation unit, the electromagnetic isolation unit comprises a metal shell, the metal shell is arranged in the shell, the metal shell is arranged above the component and covers the component, and the metal shell is also connected with the metal bottom plate to achieve conductive continuity of the metal bottom plate. By the IGBT power module, electromagnetic isolation can be effectively achieved, the application performance of the IGBT power module is improved, the service lifetime of the module is prolonged, and the stability is improved.

Description

technical field [0001] The invention relates to an IGBT power module, in particular to an IGBT power module with electromagnetic isolation function. Background technique [0002] The existing IGBT power module has the advantages of large input impedance, small driving power, simple control circuit, small switching loss, high operating frequency, and large component capacity. IGBT power modules are an important part of the semiconductor field, and are widely used in motor drives, switching power supplies, rectifiers, inverters and other fields. [0003] The potting material in the IGBT power module is to protect the power chips and lead nodes in harsh environments such as moisture, chemicals, and gases. The potting material also provides additional insulation protection between conductors to prevent excessive voltage. But the potting material does not have the function of electromagnetic isolation. Similarly, the electromagnetic isolation function cannot be realized even i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/60H01L23/043H01L23/31
CPCH01L23/043H01L23/3121H01L23/60
Inventor 郭新华戴家庆
Owner 浙江芯丰科技有限公司
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