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Diamond abrasive tool and preparation method thereof

A diamond and abrasive technology, applied in the field of abrasives, can solve the problems of short life of electroplated diamond grinding heads, uneven distribution of abrasives, easy falling off of the grinding layer, etc. Effect

Active Publication Date: 2020-12-29
LOUDI ANTAEUS ELECTRONICS CERAMICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention provides a diamond abrasive tool and a preparation method thereof, in order to solve the technical problems of uneven distribution of abrasives, easy falling off of the grinding layer, and short service life of the electroplated diamond grinding head

Method used

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  • Diamond abrasive tool and preparation method thereof

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preparation example Construction

[0025] Such as figure 1 As shown, the preparation method of the diamond abrasive tool of the present embodiment includes the following steps: coating the abrasive tool substrate with a protective layer; opening and arranging a plurality of groove structures on the substrate coated with the protective layer to obtain the processed substrate; Process the substrate for pretreatment, and then perform chemical pre-plating to obtain a pre-plating substrate; diamonds are evenly spread on the surface of the pre-plating substrate, and pressure is applied to the diamond from the upper part of the pre-plating substrate, so that the groove structure is embedded with diamonds to obtain a sand-coated substrate Electroplating the upper sand base, depositing a metal layer on the diamond surface and groove structure, and then removing the protective layer to form a grinding layer to obtain a diamond abrasive tool. The preparation method of the diamond abrasive tool of the present invention com...

Embodiment 1

[0038] (1) Use a CNC lathe to turn the abrasive matrix as required.

[0039] (2) Spray the ink on the base of the abrasive tool, and then bake it in an oven at 160°C for 25 minutes. The thickness of the ink is 0.01mm.

[0040] (3) Use a laser radium engraving machine to engrave the groove structure on the abrasive tool substrate sprayed with ink. The width of the groove structure is 0.65mm, the depth is 0.16mm, and the distance between the groove structure and the groove structure is 0.9mm. The frequency is 100kHz, the emission time is 50μs, and the scanning speed is 2000mm / s to obtain the processed substrate.

[0041] (4) Pre-treat the processed substrate, including: (1) Ultrasonic treatment: Ultrasonic treatment is performed in Wuhan Aobang degreasing powder 60g / L solution at a temperature of 65°C for 10 minutes at an ultrasonic frequency of 28kHz; (2) Electrolytic degreasing: in Wuhan Aobang degreasing powder 50g / L and 15g / L sodium hydroxide solution, the temperature is 40...

Embodiment 2

[0045] (1) Use a CNC lathe to turn the abrasive matrix as required.

[0046] (2) Spray the base of the abrasive tool with baking varnish, and then bake it in an oven at 150°C for 30 minutes, and the thickness of the ink is 0.02mm.

[0047] (3) Use a laser radium engraving machine to engrave the groove structure on the abrasive tool substrate sprayed with ink. The width of the groove structure is 0.2mm, the depth is 0.04mm, and the distance between the groove structure and the groove structure is 0.3mm. The frequency is 60kHz, the emission time is 80μs, and the scanning speed is 800mm / s to obtain the processed substrate.

[0048] (4) Pre-treat the processed substrate, including: (1) Ultrasonic treatment: Ultrasonic treatment is performed in Wuhan Aobang degreasing powder 60g / L solution at a temperature of 65°C for 10 minutes at an ultrasonic frequency of 28kHz; (2) Electrolytic degreasing: in Wuhan Aobang degreasing powder 50g / L and 15g / L sodium hydroxide solution, the tempera...

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Abstract

The invention discloses a diamond grinding tool and a preparing method thereof. The preparing method of the diamond grinding tool comprises the following steps that a grinding tool base body is coatedwith a protection layer; multiple groove structures are formed in the base body coated with the protection layer, and a machining base body is obtained; the machining base body is pre-treated, chemical pre-plating is carried out, and a pre-plated base body is obtained; diamond is evenly distributed on the base body of the pre-plated base body, pressure is applied to the diamond from the upper portion of the pre-plated base body, the diamond is embedded in the groove structures, and a sand feeding base body is obtained; the sand feeding base body is electroplated, metal layers are deposited inthe diamond surface and the groove structures, the protection layer is removed, a grinding layer is formed, and the diamond grinding tool is obtained. The preparing method of the diamond grinding tool is simple, short in time, low in cost and little in equipment funding, no pores exists in the base body and the grinding layer, and the structure is compact.

Description

technical field [0001] The invention relates to the field of grinding tools and abrasive materials, in particular, to a diamond grinding tool. In addition, the present invention also relates to a preparation method comprising the above-mentioned diamond grinding tool. Background technique [0002] With the development of the 3C industry, in order to meet the processing requirements of 3C products, the demand for processing tools is increasing, and the requirements for the accuracy and shape retention of the tools are getting higher and higher. Usually, the 3C industry uses electroplated diamond grinding heads for processing. Electroplated diamond grinding heads have the characteristics of simple forming, high precision, and good shape retention. However, electroplated diamond grinding heads have strong wear resistance, which leads to short service life of electroplated diamond grinding heads. Frequent tool changes lead to low production efficiency and increase the productio...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24D18/00
CPCB24D18/0018
Inventor 康丁华周伟雄周伍康文涛
Owner LOUDI ANTAEUS ELECTRONICS CERAMICS
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