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Etching equipment

An etching equipment and etching technology, applied in the field of etching, can solve the problems of fragmentation of the whole board, the separation of the panel from the original bottom, and the jumping of the film, so as to achieve the effect of improving uniformity and improving product yield.

Active Publication Date: 2019-02-22
WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As the size of the panel gradually increases, the panel is prone to elastic deformation during the etching process, so that the phenomenon of chip jumping often occurs, that is, the panel is separated from the original bottom position, resulting in uneven etching thickness of the panel, fragmentation or the scrapping of the entire panel.

Method used

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  • Etching equipment
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Embodiment Construction

[0024] Embodiments of the present application are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary, are only for explaining the present application, and should not be construed as limiting the present application.

[0025] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientation indicated by rear, left, right, vertical, horizontal, top, bottom, inside, outside, clockwise, counterclockwise, etc. The positional relationship is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the application and simplifying the description, and doe...

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Abstract

The invention provides etching equipment. The equipment comprises a chamber, a reaction table arranged in the chamber and at least one loading base, wherein the loading base is arranged on the reaction table, and is provided with a plurality of arc grooves. According to the equipment, the plurality of arc grooves are formed in the loading base, the technical problem that a panel is skipped in theetching process can be solved, the uniformity of panel etching can be improved, and the product yield of panels can be increased.

Description

technical field [0001] The present application relates to the technical field of etching, in particular to an etching equipment. Background technique [0002] The thinning of the display panel refers to the thinning of the panel glass by etching with mixed acid to obtain a thinner display panel, thereby reducing the thickness of the mobile phone and improving the visual effect. At present, in the panel thinning industry, the top-spray thinning method has gradually become the mainstream due to its advantages of high yield and low cost. As the size of the panel gradually increases, the panel is prone to elastic deformation during the etching process, so that the phenomenon of chip jumping often occurs, that is, the panel is separated from the original bottom position, resulting in uneven etching thickness of the panel, fragmentation or scrapping of the entire panel. Contents of the invention [0003] The embodiment of the present application provides an etching device, whic...

Claims

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Application Information

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IPC IPC(8): C03C15/00
CPCC03C15/00
Inventor 李树群
Owner WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD