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RF MEMS electrostatic driving switch microwave characteristic analysis method based on flexible substrate bending condition

A flexible substrate, electrostatic drive technology, applied in the field of mechanical analysis, can solve problems such as blank space

Active Publication Date: 2019-02-22
SOUTHEAST UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, whether it is based on silicon-based or various types of flexible substrates, the main research content and purpose of RF MEMS flexible devices are still in the stage of device design, preparation and performance testing under non-bending conditions. The bending characteristics of RFMEMS flexible devices The research on modeling and experimental characterization verification is still blank

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  • RF MEMS electrostatic driving switch microwave characteristic analysis method based on flexible substrate bending condition
  • RF MEMS electrostatic driving switch microwave characteristic analysis method based on flexible substrate bending condition
  • RF MEMS electrostatic driving switch microwave characteristic analysis method based on flexible substrate bending condition

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Embodiment Construction

[0074] The present invention will be further explained below in conjunction with the accompanying drawings.

[0075] First, for the double-ended fixed beam electrostatic drive switch:

[0076] Such as figure 1 As shown, the present invention takes the RF MEMS double-end fixed beam as an example. In this embodiment, the value of each parameter is taken. The material of the RFMEMS double-end fixed beam electrostatically driven switch beam is gold, and the flexible substrate material is liquid crystal polymer. (LCP), beam length L=600 μm, beam width w=100 μm, beam thickness t=2 μm, initial distance between upper and lower plates g=2 μm, beam Young’s modulus E=78Gpa, Poisson’s ratio n=0.42 . Assuming that the above-mentioned RF MEMS double-terminal fixed beam electrostatic drive switch initially has biaxial residual compressive stress, the beam buckles upward, and the maximum buckling distance h=0.5μm, as the flexible substrate gradually bends, the curvature of the substrate gra...

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Abstract

The invention discloses an RF MEMS electrostatic driving switch microwave characteristic analysis method based on a flexible substrate bending condition. The method comprises the steps of 1, establishing a deformation coupling model based on the double deformation of an RF MEMS electrostatic driving switch and a flexible substrate to realize the extraction of a key structural parameter variation between the RF MEMS electrostatic driving switch and the flexible substrate; and 2, based on an RF MEMS electrostatic driving switch bending characteristic model, acquiring the deformation quantity ofthe RF MEMS electrostatic driving switch / substrate double deformation. Based on the above parameters, the RF MEMS electrostatic driving switch microwave characteristic model is reconstructed to analyze the effect of bending deformation on an RF MEMS electrostatic driving switch microwave characteristic. The invention provides the RF MEMS electrostatic driving switch microwave characteristic analysis method based on a complex environment space, wherein the double deformation model of the RF MEMS electrostatic driving switch and the flexible substrate is included.

Description

technical field [0001] The invention relates to a mechanical analysis method, in particular to a method for analyzing the microwave characteristics of an RFMEMS electrostatic drive switch under the bending condition of a flexible substrate. Background technique [0002] In today's wave of information development, flexible electronic devices have very broad application prospects in the fields of national defense, information, medical treatment, and energy due to their unique bendability and high-efficiency and low-cost manufacturing processes. As a popular development direction of the new generation of semiconductor devices, flexible electronic devices are emerging electronic technologies based on bendable / extensible substrates, which fabricate active / passive organic / inorganic electronic devices on flexible substrates, which have the advantages of traditional rigid electronic systems. It also has the unique characteristics of stretching, twisting, and folding, so it has incom...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/327
CPCG01R31/327
Inventor 韩磊于洋吝晓楠吴虹剑田蕾
Owner SOUTHEAST UNIV
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