Method and device for removing electrons from surface of oxide layer of floating gate memory
A surface electronics and memory technology, applied in static memory, read-only memory, information storage, etc., can solve problems affecting the performance of floating gate memory, interfere with writing or erasing operations, etc., to solve performance degradation and prolong service life. Effect
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Embodiment 1
[0037] figure 1 It is a schematic flowchart of a method for removing electrons on the surface of an oxide layer of a floating gate memory provided by an embodiment of the present invention. The device can be implemented by a device for removing electrons on the surface of an oxide layer of a floating gate memory. The device can be implemented by hardware and / or software. Implementation, specifically includes the following steps:
[0038] A negative-pressure weak erase operation is performed on the storage units of at least one data pile or at least one data block in all the data piles.
[0039] Step 110 , the negative pressure weak erasing operation includes applying a first voltage to gates of memory cells of at least one data stack or at least one data block.
[0040] Step 120, applying a second voltage to the base of the storage unit in at least one data pile or at least one data block, the value of the first voltage is smaller than the value of the second voltage, and the...
Embodiment 2
[0044] image 3 It is a schematic flowchart of a method for removing electrons from the surface of an oxide layer of a floating gate memory provided by an embodiment of the present invention. On the basis of the above-mentioned embodiments, this embodiment defines that the negative pressure weak erase operation and the power-on operation are performed in the same time period, such as image 3 As shown, the method specifically includes the following steps:
[0045] Step 210, performing negative pressure weak erase operation on at least one data pile or storage unit of at least one data block in all data piles, the negative pressure weak erase operation includes at least one data pile or storage unit of at least one data block A first voltage is applied to the gate, and a second voltage is applied to the base of the memory cells in at least one data stack or at least one data block. The value of the first voltage is smaller than the value of the second voltage. In at least one ...
Embodiment 3
[0052] Figure 4 It is a schematic flowchart of a method for removing electrons from the surface of an oxide layer of a floating gate memory provided by an embodiment of the present invention. On the basis of the above-mentioned embodiments, this embodiment defines that the negative pressure weak erase operation and the power-on operation are performed in the same time period, such as Figure 4 As shown, the method specifically includes the following steps:
[0053] Step 310, the negative pressure weak erase operation and the erase operation are performed in the same time period.
[0054] Step 320 , performing an erasing operation on the storage unit of the selected data block in the selected data pile, the number of the selected data pile is 1, and the number of the selected data block is 1.
[0055] Wherein, during the erasing operation, a negative pressure weak erasing operation is performed on the memory cells of the non-selected data blocks in the selected data pile; a ...
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