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Method and device for removing electrons from surface of oxide layer of floating gate memory

A surface electronics and memory technology, applied in static memory, read-only memory, information storage, etc., can solve problems affecting the performance of floating gate memory, interfere with writing or erasing operations, etc., to solve performance degradation and prolong service life. Effect

Active Publication Date: 2020-12-29
GIGADEVICE SEMICON (BEIJING) INC +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This electron layer interferes with normal write or erase operations, thereby affecting the performance of floating gate memory
But there is currently no good way to solve this problem

Method used

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  • Method and device for removing electrons from surface of oxide layer of floating gate memory
  • Method and device for removing electrons from surface of oxide layer of floating gate memory
  • Method and device for removing electrons from surface of oxide layer of floating gate memory

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] figure 1 It is a schematic flowchart of a method for removing electrons on the surface of an oxide layer of a floating gate memory provided by an embodiment of the present invention. The device can be implemented by a device for removing electrons on the surface of an oxide layer of a floating gate memory. The device can be implemented by hardware and / or software. Implementation, specifically includes the following steps:

[0038] A negative-pressure weak erase operation is performed on the storage units of at least one data pile or at least one data block in all the data piles.

[0039] Step 110 , the negative pressure weak erasing operation includes applying a first voltage to gates of memory cells of at least one data stack or at least one data block.

[0040] Step 120, applying a second voltage to the base of the storage unit in at least one data pile or at least one data block, the value of the first voltage is smaller than the value of the second voltage, and the...

Embodiment 2

[0044] image 3 It is a schematic flowchart of a method for removing electrons from the surface of an oxide layer of a floating gate memory provided by an embodiment of the present invention. On the basis of the above-mentioned embodiments, this embodiment defines that the negative pressure weak erase operation and the power-on operation are performed in the same time period, such as image 3 As shown, the method specifically includes the following steps:

[0045] Step 210, performing negative pressure weak erase operation on at least one data pile or storage unit of at least one data block in all data piles, the negative pressure weak erase operation includes at least one data pile or storage unit of at least one data block A first voltage is applied to the gate, and a second voltage is applied to the base of the memory cells in at least one data stack or at least one data block. The value of the first voltage is smaller than the value of the second voltage. In at least one ...

Embodiment 3

[0052] Figure 4 It is a schematic flowchart of a method for removing electrons from the surface of an oxide layer of a floating gate memory provided by an embodiment of the present invention. On the basis of the above-mentioned embodiments, this embodiment defines that the negative pressure weak erase operation and the power-on operation are performed in the same time period, such as Figure 4 As shown, the method specifically includes the following steps:

[0053] Step 310, the negative pressure weak erase operation and the erase operation are performed in the same time period.

[0054] Step 320 , performing an erasing operation on the storage unit of the selected data block in the selected data pile, the number of the selected data pile is 1, and the number of the selected data block is 1.

[0055] Wherein, during the erasing operation, a negative pressure weak erasing operation is performed on the memory cells of the non-selected data blocks in the selected data pile; a ...

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Abstract

A method and apparatus for removing electrons from a surface of a floating gate memory oxide lay are provided, comprises performing a negative pressure weak erase operation on a storage unit of at least one data stack or at least one data block of all data stacks, A negative pressure weak erase operation includes applying a first voltage to a gate of a memory cell of at least one data stack or atleast one data block, A second voltage is applied to the substrate of the memory cells in the at least one data stack or at least one data block, the value of the first voltage being smaller than thevalue of the second voltage, and the source and drain of the memory cells in the at least one data stack or at least one data block are suspended. The embodiment of the invention provides a method anda device for removing electrons on the oxide layer surface of a floating gate memory. The negative pressure weak erasing operation is carried out on a memory cell to remove electrons captured on theoxide layer surface, thereby solving the problem of degradation of the floating gate memory performance after long-term use and prolonging the service life of the floating gate memory.

Description

technical field [0001] Embodiments of the present invention relate to the technical field of non-volatile memory, and in particular to a method and a device for removing electrons from the surface of an oxide layer of a floating gate memory. Background technique [0002] The floating gate memory adopts the floating gate field effect transistor as the basic storage unit, and the oxide layer is used to isolate the floating gate and the channel. The process of writing data is to apply positive voltage to the gate to pull electrons into the floating gate. Electrons remain in the floating gate even after the floating gate memory is powered down. In the process of erasing data, a reverse voltage is applied to the gate, and electrons are pulled out of the floating gate through the tunneling effect. Due to the leakage current of electrons in the floating gate and multiple write or erase operations, electrons will be captured on the surface of the oxide layer to form an electron la...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G11C16/04G11C16/14
CPCG11C16/0408G11C16/14
Inventor 张赛刘晓庆
Owner GIGADEVICE SEMICON (BEIJING) INC